描述：Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow M. Holtzer[2], M. Barnes[1], D.W. Lee[1], D. Heller[1], T. Cucu[2], J. Fudala[3], J. Renda[3],[1] Heller Industries, Florham Park, New Jersey (USA)MI. Alpha Assembly Solutions, South Plainfield, New Jersey (USA)[3] MacDermid Enthone Electronic Solutions, West Haven, Connecticut (USA)