思泰克 sinic-tek SPI锡膏检查机 f8

型号 Model

高性能机型

测量原理 Measurement Principle

3D 白光 PSLM PMP （可编程结构光栅相位调制轮廓测量技术，俗称摩尔条纹技术） 　　3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly known as moire fringe technology)

测量项目 Measurements

体积，面积，高度，XY偏移，形状 (volume，acreage，height， XY offset, shape )

检测不良类型 Detection of Non - Performing Types

漏印、少锡、多锡、连锡、偏位、形状不良、板面污染 　　(missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination)

相机像素 Camera Pixel

5M，可选4M/8M/12M (4M/8M/12M as option)

镜头类型 Lens Types

远心镜头telecentric lens

镜头解析度 Lens Resolution

15um，可选6/8/10/13.5/15um

视野尺寸 FOV Size

38.4*30.6mm

精度 Accuracy

XY解析度(XY Resolution)：1um；高度(height)：0.37um

重复精度 Repeatability

高度：小于1um （4 Sigma）；体积/面积：小于1%（4 Sigma） height：<1um （4 Sigma）；volume/acreage：<1%（4 Sigma）

FOV速度 FOV Speed

0.3s/FOV

检测头数量 Quantity of Inspection Head

Twin-Heads（Single Head 、Tri-Heads as option）

检测高度 Maximun Meauring Heigh

±550um (±1200um as option)

弯曲PCB测量高度 Maximun Measuring Height of PCB Warp

±5mm

PCB载板尺寸 Maximum Loading PCB Size

X510xY505mm

PCB板厚度 Thickness of the PCB

0.4-7mm

零件高度限制 Height Limitations of the Parts

up:40mm down:40mm

板边距 Board Edge Distance

3mm ，可选万能夹边 multifunctional clip edge as option

选配件 Options

万能夹边、1D/2D Barcode扫描枪、Badmark功能、印刷机闭环控制、离线编程软件、维修工作站、动态读拼板Mark点功能、同轴Mark点相机、UPS不间断电源. multifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print closed-loop control, out-line programming software, maintenance was optionkstations, dynamic. Mark point read function, coaxial Mark point camera , UPS continuous power supply.