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易胜 Essemtec 在线式点胶机 TARANTULA

设备尺寸(W*D*H): 1357*1557*1582mm

设备重量: 1670kg

电源要求: 3*300VAC/50Hz(or 3*208VAC/60Hz,3kW

气源要求: 6 - 7 bar (87 - 102 psi)

设备简介: The Tarantula - State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more. Tarantula设备可以同时运用电子制造中所需要的多种胶体、粘结剂,如高速喷印锡膏,SMT胶,LED封装,银环氧树脂,散热胶,密封硅胶等等来处理复杂的工艺。这些工艺包括Dan and fill,底部填充,腔体喷锡,激光高度测量配合的3D点胶等等。展开更多

设备参数
设备文档
配件清单
Accuracy
Linear encoder resolution (x,y)
0.2 µm
Dispensing accuracy XY dots
± 40 µm
Positioning accuracy Z axis
± 20 µm
PCB尺寸
Min. PCB dimensions
50 x 50mm (2 x 2")
Max. PCB dimensions
560 x 610 mm (22 x 24 '')
PCB thickness
0.5-5.0 mm (0.02 - 0.2")
PCB edge clearance
topside 3.0mm(0.11'') bottomside 5.0(0.2'')
Max. Board weight
4 kg (8.8 lb)
Conveyor height
SMEMA 940 965 mm
Clearance below PCB
27mm(1.1'')
Process
Dispensing speed up to
Piezo Jet valve 145000dots/h Pneumatic Jet valve 77000dots/h Time/pressure valve 26000dots/h Archimedean screw valve 22000dots/h Volume dispenser valve 22000dots/h
Dispensing mode
dot, line, 3D, curve, interpolated curves on multiple layers 2)
Programmable z-stroke
80 mm (3.35")
Process height
±18mm(0.71'') from zero height
Number of processes
Up to 3x valves simultaneously
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