库力索法 Kulicke & Soffa 贴片机 APAMA C2S
设备尺寸(W*D*H): 4.09 x 1.86 x 2.19 m
设备重量:
电源要求:
气源要求:
设备简介:The APAMA Chip-to-Substrate (C2S) offers fully Automated solution for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC). Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers. 展开更多
设备参数
设备文档
配件清单
| Specification | |
|---|---|
Accuracy | Glass Die 1.5 µm (3σ)
Post-Bond 2.0 µm (3σ) |
Planarity | 1 µm / 10 mm |
Force | 3 - 300 N standard;
500 N optional |
Heating Ramp | 350 °C/sec (up to 20 mm) |
Cooling Rate | 140 °C/sec (up to 20 mm) |
Source Wafer | 200 – 300mm, JEDEC tray input |
Target Material Handling | Up to 100 mm x 300 mm
160 mm x 310 mm optional
(substrates, carriers) |
Die Size | 1 - 20 mm standard; 1 - 33 mm optional |
Die Thickness | > 75 µm standard; > 35 µm optional |
Process Monitor Features
for Yield Enhancement | In-situ bond profile monitoring
Actual bondhead temperature verification
Solder melt time monitoring
Flux coverage inspection
Flux imprint inspection
Bondhead vacuum clogging detection
Auto bondhead planarity healthy check
Post-bond inspection
Bond Tool Contamination detection |
cover | Stainless Steel,
painted |
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