库力索法 Kulicke & Soffa 贴片机 Katalyst
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设备简介:Kulicke & So a’s Katalyst™ delivers the industry’s highest accuracy and speed for flip-chip placement. Its hardware and technology enable < 3 μm accuracy on substrate or wafer, achieving the best Cost-of-Ownership in the industry. Kulicke & Soffa 的Katalyst™提供业界最高的倒装芯片贴装精度和速度。其硬件和技术可在基板或晶圆上实现 < 3 μm 的精度，实现业内最佳的拥有成本。展开更多
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| Technical Specifications | |
|---|---|
Typical Applications | BGA, QFN, eWLB, and WHA |
Accuracy | < 3 μm at 3 σ |
Throughput | 15K UPH (real production with 100 ms dip and bond times) |
Die Size (8 or 12 inch Wafer) | 1 - 15.5 mm (6 nozzles, 15K UPH)
16 - 30 mm (3 nozzles, 7K UPH) |
Die Thickness | > 50 μm |
Substrate Types | Carriers, boats, and bare substrates |
Substrate Size | 340 x 340 mm (bondable area 330 x 330 mm)
Single, dual, and triple lanes indexing |
Substrate / Carrier Thickness | 0.1 - 6 mm |
Bond Force | 0.5 - 25 N |
Tool Changers | Die Ejector, Pick Tool, and Place Tool Changers |
Product Changeover Time | < 30 min changeover (fully automated) |
Clean Room Class | 1000 |
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