动力焊接法Kulicke & Soffa自动焊机RAPID MEM
设备尺寸(W*D*H): 889 mm wide x 1009 mm deep (35” x 39.7”)
设备重量: 590 kg (1300 lbs)
电源要求: 200 - 240 VAC; - 15% to + 10%
气源要求: 185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)
设备简介:RAPID™ MEM introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.展开更多
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配件清单
| WIRE BONDING CAPABILITY | |
|---|---|
Ultra Fine Pitch | 35 μm inline bond pad pitch |
Wire Size | 0.6 mil to 2.5 mil Cu, Ag, or Au wire |
Bonding Area | X Axis: 56 mm
Y Axis: 80 mm (Standard), 87 mm (LA), 90 mm (ELA) |
Total Bond Placement Accuracy | 2.0 μm @ 3 sigma |
Pattern Recognition/Optics/Vision | Higher Resolution Progressive Scan Vision System CCD Camera |
| LOOPING CAPABILITY | |
|---|---|
Maximum Wire Length | 7.6 mm with 1.0 mil wire
3.0 mm with 0.6 mil wire |
Minimum Loop Height | Ultra-low loop with Power Series Low Loop
40 μm with 0.6 mil wire |
| Conversion times | |
|---|---|
Same Leadframe Type: | ‹ 4 min |
Di erent Leadframe Type: | ‹ 8 min |
| MAN-MACHINE INTERFACE | |
|---|---|
Monitior | 21.5" color LCD display |
Durable control panel | Function keys and dedicated buttons, and user-friendly mouse. |
Industry-Recognized User Interface | Simple pull-down menus. Color-overlays of wire groups for easy
programming and teach. |
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