设备尺寸(W*D*H): 889 mm wide x 990 mm deep (35” x 39”)
设备重量: 556 kg (1226 lbs)
电源要求: 200 - 240 VAC; -15 % to + 10%
气源要求: 185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)
设备简介:OptoLux™ high speed wire bonder is the latest generation ball bonder that sets the new standards and benchmark in the LED market. 展开更多
WIRE BONDING CAPABILITY | |
---|---|
Bonding Area | X Axis: 56 mm
Y Axis: 80 mm |
Total Bond Placement Accuracy | 3.0 μm @ 3 sigma |
Speed | 21 wires per second
(2 mm wire length) |
Pattern Recognition/Optics/Vision | Progressive Scan Vision Engine CCD Video Camera
- 2X Magnification Optics |
LOOPING CAPABILITY | |
---|---|
Maximum Wire Length | 5 mm |
Minimum Loop Height | 65 μm Quick Loop-LED supports for flexible loop shapes for improved reliability |
Wire Sway | Wire length < 2.54 mm: 25 μm @ 3 sigma
Wire length > 2.54 mm: ± 1 % wire length @ 3 sigma |
Conversion times | |
---|---|
Same Leadframe Type: | < 5 min |
Different Leadframe Type: | < 20 min |
MAN-MACHINE INTERFACE | |
---|---|
Monitor | 17” color LCD display |
Durable control panel | Function keys and dedicated buttons, and user-friendly mouse |
Industry-Recognized user interface | Simple pull-down menus. Color-overlays of wire groups for easy
programming and teach |
暂无设备