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自动焊接机OPTOLUX

设备尺寸(W*D*H): 889 mm wide x 990 mm deep (35” x 39”)

设备重量: 556 kg (1226 lbs)

电源要求: 200 - 240 VAC; -15 % to + 10%

气源要求: 185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)

设备简介:OptoLux™ high speed wire bonder is the latest generation ball bonder that sets the new standards and benchmark in the LED market. 展开更多

设备参数
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设备参数

WIRE BONDING CAPABILITY
Bonding Area
X Axis: 56 mm Y Axis: 80 mm
Total Bond Placement Accuracy
3.0 μm @ 3 sigma
Speed
21 wires per second (2 mm wire length)
Pattern Recognition/Optics/Vision
Progressive Scan Vision Engine CCD Video Camera - 2X Magnification Optics
LOOPING CAPABILITY
Maximum Wire Length
5 mm
Minimum Loop Height
65 μm Quick Loop-LED supports for flexible loop shapes for improved reliability
Wire Sway
Wire length < 2.54 mm: 25 μm @ 3 sigma Wire length > 2.54 mm: ± 1 % wire length @ 3 sigma
Conversion times
Same Leadframe Type:
< 5 min
Different Leadframe Type:
< 20 min
MAN-MACHINE INTERFACE
Monitor
17” color LCD display
Durable control panel
Function keys and dedicated buttons, and user-friendly mouse
Industry-Recognized user interface
Simple pull-down menus. Color-overlays of wire groups for easy programming and teach

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