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Cyberoptics SMT自动光学检测机SQ 3000—3D—AOI

设备尺寸(W*D*H): 1100x1270x1390mm

设备重量: 约965kg

电源要求: s100-120VAC or 220-240VAC,50/60hz,10 amp max

气源要求: N/A

设备简介:The SQ3000 is powered by CyberOptics’ breakthrough 3D sensing technology comprising four multiview 3D sensors and a parallel and transmits multiple images in parallel while proprietary 3D fusing CyberOptics’ unique sensor architecture simultaneously captures projector delivering metrology grade accuracy at production speed. algorithms merge the images together. The result is ultra-high quality 3D images and highspeed inspection.展开更多

设备参数
设备文档
配件清单

设备参数

规格参数
Inspection Capabilities
MRS Sensor
Inspection Speed
40cm²/sec(2D+3D)
Minimum Component Size
0402mm(01005inch)
PCB Size
510x510mm(20x20inch)
Component Height Clearance
Top:50mm; Bottom:30mm
PCB Thickness
0.3-5mm
Component Types Inspected
Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more
Component Defects
Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more
Solder Joint and Other Defects
Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins
3D Measurement Inspection
Lifted Lead, package coplanarity, polarity dimple and chamfer identification
Measurement Gage R&R
<10%@±3σ(±80µm process tolerance)
Z Height Accuracy
1µm on certification target
Z Height Measurement Range
6mm at spec, 24mm capability
High Speed option available
50cm²/sec(2D+3D)
Vision System & Technology
Imagers
Multi-3D sensors
Resolution
Sub 10µm
Image Processing
Autonomous Image Interpretation (AI²) Technology, Coplanarity and Lead Measurement
Programming Time
<15 minutes (for established libraries)
CAD Import
Any column-separated text file with ref designator, XY, Angle, Part no info; Valor process preparation
Machine Interface
SMEMA, RS232 and Ethernet
Options
Barcode Reader
Rework station
SPC Software
Alignment Target
SQ3000-X (Large Board Capability)
SQ3000-D (Dual Lane),
SQ3000-DD (Dual Lane - Dual Sensor) models available
Ultra High Resolution MRS Sensor
Inspection Speed
15cm²/sec(2D+3D)
Minimum Component Size
0201mm(008004 inch)
Z Height Measurement Range
3mm at spec, 10mm capability
Resolution Sub
7µm

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