设备尺寸(W*D*H): 2710*1670*1630MM
设备重量: 2200KG
电源要求: 3相 380V 50/60HZ
气源要求: 0.5~0.8MPA
设备简介:1、国内首创双电磁泵选择性波峰焊; 2、高效节能; 3、J顶尖品质; 4、全程显示焊接状态; 5、采用德国进滴喷头,精度高; 6、快速便捷的编程系统
机身参数 | |
---|---|
最大PCB板尺寸 Max.PCB Size (mm) | 510(L)×450(W) |
最小PCB板尺寸 Min.PCB Size (mm) | 120(L)×50(W) |
PCBJ顶部间隙 PCB Top Side Clearance (mm) | 120 |
PCB底部间隙PCB Bottom Side Clearance (mm) | 40 |
PCB工艺边/PCB technics side (mm) | 大于等于3 |
传送带距离地面高度Conveyor Height From Floor (mm) | 850±25 |
PCB传送速度/PCB conveyor speed (mm/s) | 0-200mm/s |
PCB重量Max / PCB Weight (kg) | ≤5 |
PCB厚度(包含治具)PCB Thickness With Jig (mm) | 1-6 |
传送带可调范围/Conveyor width adjustment(mm) | 50-450 |
传送带调宽方式/Conveyor width adjustment mode | 电动/Electromotion |
PCB传送方向/PCB Conveyor direction | 左向右/Left to right |
废气排放量/Overall exhaust level(m3/h) | 150*2 |
环境温度/Ambient temperature (EC) | 10-35
|
通讯接口/Communication interface | SMEMA |
焊接系统 | |
---|---|
焊接喷嘴/Solder nozzle | 高精度单喷嘴/High precision single nozzle |
最小喷嘴外径/Smallest nozzle outer diameter (mm) | 5.5 |
喷嘴内径/Nozzle inner diameter (mm) | 2.5-10 |
最大波峰高度/Max solder wave height (mm) | 5 |
锡炉容量(单锡炉)/Solder volume (single pot)(kg) | 13 |
最大焊接温度/Max solder temperature (℃) | 330° |
锡炉加热功率/Soldering heating power (kw)
| 1.5*2 |
氮气消耗量(单锡炉)/Nitrogen consumption(single pot)(m3/h) | 1.5 |
所需氮气纯度/Required particle cleanliness (%)
| 99.999% |
预热系统 | |
---|---|
预热温度范围/Preheat temperature range (℃) | <200 |
预热控温精度/Preheat control accuracy (℃) | ±2 |
加热功率/Preheating medium (kw)
| 24 |
PCB温度均匀性/PCB temperature uniformity (℃) | 5 |
加热方式/Preheating medium | 热风+红外/Hot air+Infrared |
顶部预热/Top side preheating | 热风/Hot air |
喷雾系统 | |
---|---|
喷雾高度/Spray height(mm) | 60 |
喷雾速度/Control speed(mm/s) | ≤400 |
喷嘴自动清洗功能/Spray head automatically cleaning
| 程序控制/Program control |
助焊剂流量/Flux consumption(ml/min) | 2-60 |
助焊剂箱体容量/Flux content(L) | 2 |
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