Cyberoptics SMT自动光学检查机 SQ3000-DD™

设备尺寸(W*D*H): 1700.5x1620x1520mm

设备重量: ≈1596kg

电源要求: 100-120VAC or 220-240VAC, 50/60HZ, 10amp max.

气源要求: N/A

设备简介:SQ3000-DD™ 3D AOI The Ultimate in Speed and Accuracy Dual Lane - Dual Sensor Inspection System.

设备参数

设备文档

配件清单

规格参数
Inspection Capabilities	MRS Sensor
Inspection Speed	40cm²/sec(2D+3D)
High Speed option available	50cm²/sec(2D+3D)
Minimum Component Size	0402mm(01005inch)
PCB Size (Max.)	Single Lane: 510x510mm(20x20inch), Dual Lane:510x330mm (20x13inch)
Component Height Clearance	Top:50mm, Bottom:35mm
PCB Thickness	0.3-5mm
Component Types Inspected	Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more
Component Defects	Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more
Solder Joint and Other Defects	Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins
3D Measurement Inspection	Lifted Lead, package coplanarity, polarity dimple and chamfer identification
Measurement Gage R&R	<10%@±3σ(±80µm process tolerance)
Z Height Accuracy	1µm on certification target
Z Height Measurement Range	6mm at spec, 24mm capability

Vision System & Technology
Imagers	Multi-3D sensors
Resolution	Sub 10µm
Image Processing	Autonomous Image Interpretation(AI2)Technology, Coplanarity and Lead Measurement
Programming Time	<15minutes (for established libraries)
CAD Import	Any column-separated text file with ref designator, XY, Angle, Part no info; Valor process preparation
Machine Interface	SMEMA, RS232 and Ethernet

Ultra High Resolution MRS Sensor
Inspection Speed	15cm²/sec(2D+3D)
Minimum Component Size	0201mm(008004 inch)
Z Height Measurement Range	3mm at spec, 10mm capability
Resolution	7µm

Options
Barcode Reader	Rework station
SPC Software	Alignment Target
Standard SQ3000	SQ3000-X (Large Board Capability)
SQ3000-D (Dual Lane) models available

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服务号

联系电话：0755-27820151

地址：广东省深圳市宝安区航城大道159号航城创新创业园B2栋101