Cyberoptics SMT自动光学检查机 SQ3000+
设备尺寸(W*D*H): 1350x1480x1750mm
设备重量: ≈1670kg
电源要求: 100-120VAC or 220-240VAC(±10%), 50/60HZ, 10-15 amps
气源要求: 5.6Kgf/cm²to7.0 Kgf/cm²(80 to 100psi@4cfm)
设备简介:SQ3000+ Multi-Function System with Multi-Reflection Suppression™ (MRS™) sensor technology provides the ultimate combination of high resolution, high accuracy and high speed for inspection and metrology. It remains the only system on the market capable of performing AOI, SPI and CMM in-line.展开更多
设备参数
设备文档
配件清单
| 规格参数 | |
|---|---|
Inspection Capabilities | 5 Micron Ultra-High Resolution MRS Sensor |
Inspection Speed | 16cm²/sec(2D+3D) |
Minimum Component Size | 0201mm(008004inch) |
PCB Size | Minimum:50x50mm(2x2inch); Maximum:420x320mm (16.5x12.5inch) |
Component Height Clearance | Top:20mm ; Bottom:50mm |
PCB Thickness
| 0.1-5mm |
Component Types Inspected | Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more |
Component Defects | Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more |
Solder Joint and Other Defects | Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins |
3D Measurement Inspection | Lifted Lead, package coplanarity, polarity dimple and chamfer identification |
Measurement Gage R&R | <10%@±3σ(±30 µm process tolerance) |
Z Height Accuracy | 0.5µm on certification target |
Z Height Measurement Range | 400µm at spec, 2.4mm capability |
| CMM Capabilities | |
|---|---|
Accuracy XY/Z | 2µm/0.5µm |
Resolution XY/Z | 5µm/0.1µm |
Maximum Weight | 10kg |
Min./ Max. Feature Height | Min.10µm ; Max.400µm at spec, 2.4mm capability |
Maximum Feature Size | 420x320mm(16.5x12.5inch) |
Carrier Thickness | 0.1-5mm |
Coordinate Measurement
Capability | Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Offset,
X,Y Offset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius,
Coplanarity/ Distance to plane / 2nd Order fitting, Difference / Absolute / 2sqrt / VC, Max /
Min / Ave / Sigma / Plus / Minus / Multiple |
| Vision System & Technology | |
|---|---|
Imagers
| Multi-3D sensors |
Resolution | 5µm |
Field of View (FOV) | 25x25mm |
Image Processing | Autonomous Image Interpretation (AI²) Technology, Coplanarity and Lead Measurement |
Programming Time | <13minutes (for established libraries) |
CAD Import | Any column-separated text file with ref designator, XY, Angle, Part no info; Valor process preparation |
Machine Interface | SMEMA, RS232 and Ethernet |
| Options | |
|---|---|
Barcode Reader | Rework station |
CyberReport SPC Software | Alignment Target |
SQ3000™, SQ3000™ X (Large Board) | SQ3000™ D (Dual Lane) |
SQ3000™ DD (Dual Lane - Dual Sensor) models available |
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