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Cyberoptics SMT自动光学检查机 QX150i-B™ 2D AOI

设备尺寸(W*D*H): 1000x880.6 x1320.1mm

设备重量: ≈279kgs

电源要求: 100-120VAC or 220-240VAC, 50/60HZ, 10-15 amps

气源要求: N/A

设备简介:QX150i-B™ 2D AOI The SIM (Strobed Inspection Module) is the core engine behind every QX150i-BTM system enabling ‘on-the-fly’ high performance inspection. Designed and manufactured exclusively by CyberOptics, the SIM is absolutely calibration-free and illuminates only when needed – reducing cost of ownership and power consumption. 展开更多

设备参数
设备文档
配件清单
规格参数
Typical Scanning Speed
200cm²/sec(31inch²/sec)
Minimum Component Size
0402mm(01005inch)
Board Length
Min.50mm(2inch)/ Max.400mm(15.7inch)
Board Width
Min.50mm(2inch)/Max.308mm(12inch)
Component Height Clearance (max)
Top:100mm(3.93inch) Bottom:33mm(1.29inch)
Board Edge Clearance (min)
3.0mm(0.125inch)–bottom side only
Component Types Inspected
Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and others
Component Defect Categories
Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and others
Solder Joint Defects Categories
Solder bridge, opens, lifted leads, wettability, excess and in sufficient solder, debris, and others
Other Items Detected
Gold-finger contamination, pin-in-hole, bent pins, debris, and many others
Component Measurement Categories
Component X, Y position and Rotation
Measurement Gage R&R
<10%(down to 0402mm components)
Vision System
Image Transfer Protocol
PCIe
Lighting
Strobe White Light (with dark/bright field)
Image Processing
Statistical Appearance Modeling (SAM™ ) Technology. Option: Autonomous Image Interpretation (AI²) Technology
Programming
Simple inline or offline
CAD Import
Any column separated text file (Standard information required – ref. designator, XY, Angle, Part no.)
System Specifications
Conveyor Height
Adjustable to 840–990mm(33.1–38.9inch)
Machine Interface
SMEMA, RS232 and Ethernet
Machine Installation
<1hour
Inspection Capabilities
Inspection Capabilities
QX150i-B
QX100i-B
Imagers
80 Megapixel Sensor
40 Megapixel Sensor
Resolution
12μm pixel size
17μm pixel size
Weight
≈279kgs (615 lbs.)
≈219kgs (483 lbs.)
Options
SPC Software
Offline Defect Rework Station
Sensor Alignment Target
Barcode Readers (1D/2D)
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