Cyberoptics SMT自动光学检测机QX 150 i ™ 2D
设备尺寸(W*D*H): 1000x880.6x1320.1mm
设备重量: ≈219kgs
电源要求: 100-120VAC or 220-240VAC, 50/60hz, 10-15 amps
气源要求: N/A
设备简介:The QX150i™ AOI system offers high value and high flexibility for all applications and is ideally suited for pre-reflow and selective solder inspection. The Strobed Inspection Module (SIM), the core engine behind QX150i™, enables on-the-fly inspection assuring a fast and smooth process.展开更多
设备参数
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配件清单
| 规格参数 | |
|---|---|
Typical Scanning Speed | 200cm²/sec(31inch²/sec) |
Minimum Component Size | 0402mm(01005inch) |
Board Width | Min.50mm(2inch)/Max.308mm(12inch) |
Board Edge Clearance (min) | 3.0mm(0.125inch)–bottom side only |
Component Types Inspected | Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and others
|
Component Defect Categories
| Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and others |
Solder Joint Defects Categories | Solder bridge, opens, lifted leads, wettability, excess and in sufficient solder, debris, and others |
Other Items Detected
| Gold-finger contamination, pin-in-hole, bent pins, debris, and many others |
Component Measurement
Categories | Component X, Y position and Rotation |
Measurement Gage R&R | <10%(down to 0402 mm components) |
| Vision System | |
|---|---|
Image Transfer Protocol | PCIe |
Lighting | Strobe White Light (with dark/bright field) |
Image Processing | Statistical Appearance Modeling (SAM™ ) Technology.Option: Autonomous Image Interpretation (AI²) Technology |
Programming | Simple inline or offline |
CAD Import | Any column separated text file (Standard information required – ref.
designator, XY, Angle, Part no.) |
| System Specifications | |
|---|---|
Conveyor Height | Adjustable to 840–990mm(33.1–38.9inch) |
Machine Interface | SMEMA, RS232 and Ethernet |
Machine Installation | <1hour |
| Inspection Capabilities | ||
|---|---|---|
Inspection Capabilities | QX150i | QX100i |
Board Length | Min.50mm(2inch)/Max.400mm (15.7inch) | Min.50mm(2inch)/Max.410mm (16.1 inch) |
Component Height Clearance
(max) | Top:35mm(1.37inch)
Bottom:23mm(0.90inch) | Top:30mm(1.18inch)
Bottom:25mm(0.98inch) |
Imagers | 80 Megapixel Sensor | 40 Megapixel Sensor |
Resolution | 12μm pixel size | 17μm pixel size |
| Options | |
|---|---|
SPC Software | Offline Defect Rework Station |
Sensor Alignment Target | Barcode Readers (1D/2D) |
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