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Cyberoptics (在线)SPI锡膏检查机 SE3000™

设备尺寸(W*D*H): 1100x1270x1390mm

设备重量: ≈965kg(2127 lbs.)

电源要求: 100-120VAC or 220-240VAC,50/60hz,10-15amps

气源要求: 5.6~7.0Kgf/cm²

设备简介:The SE3000 SPI System brings the revolutionary MRS technology to solder paste inspection delivering higher performance in accuracy and precision. Effective suppression of multiple reflections is critical, making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.展开更多

设备参数
设备文档
配件清单
规格参数
Panel Size Capacity
Min:50x50mm(2x2inch) ; Max:510x510mm(20x20inch)
Maximum Panel Weight
3kg(6.6lbs)
Board Thickness
0.3~5.0mm(0.01~0.2inch)
Board Edge Clearance
Top:2.5mm(0.1inch) ; Bottom:3.0mm(0.12 inch)
Clearance
Top(above belt):30mm(1.18inch) ; Bottom:35mm(1.38inch)
Conveyor Speed Range
150-450mm/sec(5.9-17.7inch/sec)
Conveyor Adjustment
Automatic
Functional Specifications
Maximum Inspection Area
510x503mm(20x19.8inch)
Maximum Pad Size in FOV
15x15mm( 0.6x0.6inch)
Measurement Types
Height, Area, Volume, Registration, Bridge Detection, Defect Review
Height Accuracy
3µm on a Certification Target
Height Measurement Range
1mm
Imagers
Multi-3D sensors
Machine Interface
SMEMA, RS232 and Ethernet
Inspection Capabilities
Inspection Capabilities
MRS Sensor Ultra
High Resolution MRS Sensor
Inspection Speed
Peak:35cm²/sec(2D+3D) Average:30 cm²/sec(2D+3D)
Peak:15cm²/sec(2D+3D) Average:12cm²/sec(2D+3D)
Minimum Component Aperture Size
0402mm(01005inch)
0201mm(008004inch)
Field-of-View (FOV)
36x36mm(1.42x1.42inch)
21x21mm(0.82x0.82inch)
3D Resolution
18 µm
9 µm
Measurement Gage R&R
<10%, 6 σ on Printed Circuit Board; <5% 6 σ on Certification Target
<5%, 6 σ on Printed Circuit Board; <3% 6 σ on Certification Target
Options
SPC software
Barcode Readers (1D/2D)
Programming Software
ePM-SPI/AOI & GC-PowerPlace
Offline Defect Review
Certification Target
SE3000-D (Dual Lane)
SE3000-DD (Dual Lane - Dual Sensor) models available
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