Cyberoptics （在线）SPI锡膏检查机 SE3000-X™
设备尺寸(W*D*H): 1330x1400x1390mm
设备重量: ≈1242kg
电源要求: 100-120VAC or 220-240VAC,50/60hz,10-15amps
气源要求: 5.6~7.0Kgf/cm²
设备简介:Maximize yields with the World’s First SPI system incorporating the MRS Sensor technology. When only the very best will do.展开更多
设备参数
设备文档
配件清单
| 规格参数 | |
|---|---|
Panel Size Capacity | Min:50x120mm(2x4.7inch) ;
Max:710x610mm(27.9x24inch) |
Maximum Panel Weight | 10kg(22.04 lbs) |
Board Thickness | 0.5~ 6.0mm(0.02~0.24inch) |
Board Edge Clearance | Top:3mm(0.12inch) ;
Bottom:3mm(0.12inch) |
Clearance | Top(above belt):30mm(1.18inch) ;
Bottom:35mm(1.38inch) |
Conveyor Speed Range | 150-450mm/sec(5.9-17.7inch/sec) |
Conveyor Adjustment | Automatic |
| Functional Specifications | |
|---|---|
Maximum Inspection Area | 710x602mm(27.9x23.7inch) |
Maximum Pad Size in FOV | 15x15mm(0.6x0.6inch) |
Measurement Types | Height, Area, Volume, Registration, Bridge Detection, Defect Review |
Height Accuracy | 3µm on a Certification Target |
Height Measurement Range | 1mm |
Imagers | Multi-3D sensors |
Machine Interface | SMEMA, RS232 and Ethernet |
| Inspection Capabilities | ||
|---|---|---|
Inspection Capabilities | MRS Sensor Ultra | High Resolution MRS Sensor |
Inspection Speed | Peak:35cm²/sec(2D+3D)
Average:30cm²/sec(2D+3D) | Peak:15cm²/sec(2D+3D)
Average:12cm²/sec(2D+3D) |
Minimum Component Aperture
Siz | 0402mm(01005inch) | 0201mm(008004inch) |
Field-of-View (FOV) | 36x36mm(1.42x1.42inch) | 21x21mm(0.82x0.82inch) |
3D Resolution | 18 µm | 9 µm |
Measurement Gage R&R | <10%, 6 σ on Printed Circuit Board;
<5% 6 σ onCertification Target | <5%, 6 σ on Printed Circuit
Board; <3% 6 σ on
Certification Target |
| Options | |
|---|---|
SPC software | Barcode Readers (1D/2D) |
Programming Software | ePM-SPI/AOI & GC-PowerPlace |
Offline Defect Review | Certification Target |
SE3000-D (Dual Lane) | SE3000-DD (Dual Lane - Dual Sensor) models available |
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