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Cyberoptics (在线)SPI锡膏检查机 SE3000-XL

设备尺寸(W*D*H): 1990x1400x1390mm

设备重量: ≈1279kg

电源要求: 100-120VAC or 220-240VAC,50/60hz,10-15amps

气源要求: 5.6~7.0Kgf/cm²

设备简介:SE3000-XL also available for large board capability.Maximize yields with the World’s First SPI system incorporating the MRS Sensor technology. When only the very best will do.展开更多

设备参数
设备文档
配件清单
Panel Size Capacity(with 2 index inspection capability)
Minimum
Maximum
50x120mm(2x4.7inch)
1200x610mm(47.2x24.0inch)
规格参数
Maximum Panel Weight
10kg(22.04 lbs)
Board Thickness
0.5~ 6.0mm(0.02~0.24inch)
Board Edge Clearance
Top:3mm(0.12inch) ; Bottom:3mm(0.12inch)
Clearance
Top(above belt):30mm(1.18inch) ; Bottom:35mm(1.38inch)
Conveyor Speed Range
150-450mm/sec(5.9-17.7inch/sec)
Conveyor Adjustment
Automatic
Functional Specifications
Maximum Inspection Area
1200x602mm(47.2x23.7inch)
Maximum Pad Size in FOV
15x15mm(0.6x0.6inch)
Measurement Types
Height, Area, Volume, Registration, Bridge Detection, Defect Review
Height Accuracy
3µm on a Certification Target
Height Measurement Range
1mm
Imagers
Multi-3D sensors
Machine Interface
SMEMA, RS232 and Ethernet
Inspection Capabilities
Inspection Capabilities
MRS Sensor Ultra
High Resolution MRS Sensor
Inspection Speed
Peak:35cm²/sec(2D+3D) Average:30cm²/sec(2D+3D)
Peak:15cm²/sec(2D+3D) Average:12cm²/sec(2D+3D)
Minimum Component Aperture Siz
0402mm(01005inch)
0201mm(008004inch)
Field-of-View (FOV)
36x36mm(1.42x1.42inch)
21x21mm(0.82x0.82inch)
3D Resolution
18 µm
9 µm
Measurement Gage R&R
<10%, 6 σ on Printed Circuit Board; <5% 6 σ onCertification Target
<5%, 6 σ on Printed Circuit Board; <3% 6 σ on Certification Target
Options
SPC software
Barcode Readers (1D/2D)
Programming Software
ePM-SPI/AOI & GC-PowerPlace
Offline Defect Review
Certification Target
SE3000-D (Dual Lane)
SE3000-DD (Dual Lane - Dual Sensor) models available
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