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Cyberoptics (在线)SPI锡膏检查机 SE3000-DD™

设备尺寸(W*D*H): 1700.5x1620x1520mm

设备重量: ≈1596kg

电源要求: 100-120VAC or 220-240VAC, 50/60hz, 10-15 amps

气源要求: 5.6~7.0Kgf/cm²

设备简介:SE3000™ DD 3D SPI Ultimate Precision Accuracy with World-class Usability Dual Lane - Dual Sensor Inspection System.展开更多

设备参数
设备文档
配件清单
Inspection Capabilities
Inspection Capabilities
Standard MRS Sensor
Ultra-High Resolution MRS Sensor
Inspection Speed
35cm²/sec(2D+3D)
15cm²/sec(2D+3D)
Minimum Component Size
0402mm(01005inch)
0201mm(008004inch)
Measurement Gage R&R
<10%, 6 σ on Printed Circuit Board; <5% 6 σ on Certification Target
<5%, 6 σ on Printed Circuit Board; <3% 6 σ on Certification Target
3D Resolution
18 µm
9 µm
Field of View (FOV)
36x36mm(1.42x1.42inch)
21x21mm(0.82x0.82inch)
Panel Size (Max.)
Single Lane
Dual Lane
510x510mm(20x20inch)
350x320mm(13.7x12.5inch)
Maximum Inspection Area
Single Lane
Dual Lane
504x504mm(19.84x19.84inch)
344x314mm(13.54x12.36inch)
规格参数
Clearance
Top:50mm(1.96inch); Bottom:30mm(1.18inch)
Panel Thickness
0.3~5.0mm(0.01~0.2inch)
Panel Edge Clearance
3mm(0.12inch)
Maximum Panel Weight
3kg(6.6 lbs)
Measurement Types
Height, Area, Volume, Registration, Bridge Detection, Defect Review
Z Height Accuracy
3μm on a Certification Target
Z Height Measurement Range
1 mm
Conveyor Speed Range
150-450mm/sec(5.9-17.7inch/sec)
Conveyor Adjustment
Automatic
Vision System & Technology
Imagers
Multi-3D sensors
Maximum Pad Size in FOV
15x15mm(0.6x0.6inch)
Machine Interface
SMEMA, RS232 and Ethernet
Options
Barcode Reader
Rework station
SPC Software
Alignment Target
Standard SE3000
SE3000 X and SE3000XL models available
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