Cyberoptics SMT自动光学检查机 MX3000™
设备尺寸(W*D*H): 2000.69x2000.83x2000.38mm
设备重量: 4000kg
电源要求: AC 220V, 3 phase, 60 Hz, 4 wire, Amp: 50A
气源要求: N/A
设备简介:The MX3000™ is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS™ Sensors delivering simultaneous dual-sided automated final vision inspection for singulated memory modules – for metrology grade accuracy at production speed.展开更多
设备参数
设备文档
配件清单
| Inspection Capabilities | |
|---|---|
Inspection Speed | 50cm²/sec(2D+3D) |
Minimum Component Size
| 0402mm(01005inch) |
Board Length | Min.25mm/Max.140mm |
Board Width | Min.17mm/Max.35mm |
Component Height Clearance (max) | 35mm |
Component Types Inspected | Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more |
Solder Joint Defects Categories | Solder bridge, opens, lifted leads, wettability, excess and insufficient solder, debris, and more |
3D Measurement inspection | Lifted lead, package coplanarity, polarity dimple and chamfer identification |
Other Items Detected | Gold-finger contamination, pin-in-hole, bent pins, debris, OCR/OCV and many others |
Component Measurement
Categories | Component X, Y position and Rotation |
| Vision System | |
|---|---|
Imagers | Multi-3D sensors |
Image Transfer Protocol | PCIe |
Resolution | Sub 10 µm |
Image Processing | Autonomous Image Interpretation (AI²) Technology, coplanarity and lead measurement |
Programming | Simple inline or offline |
CAD Import | Any column separated text file (Standard information required - ref designator, XY, Angle, Part no.,) |
| Options | |
|---|---|
SPC Software | Alignment Target |
Tray Loader/ Unloader
Elevated Card | 2nd Review Station |
加入供应商
暂无设备
Copyright ©2025 深圳市五一表面贴装技术有限公司
联系电话：0755-27820151
地址：广东省深圳市宝安区航城大道159号航城创新创业园B2栋101