Cyberoptics SMT自动光学检查机 MX600™ 2D
设备尺寸(W*D*H): 2000.5x2000.75x2000.05mm
设备重量: 4.500kg
电源要求: AC220V, 3phase, 60Hz, 4 wire, Amp: 50A
气源要求: N/A
设备简介:The MX600™ is designed with SIM Technology (Strobed Inspection Module) with enhanced illumination – delivering the best Automated Final Vision Inspection for singulated memory modules.展开更多
设备参数
设备文档
配件清单
| Inspection Capabilities | |
|---|---|
Inspection Speed | 110 cm²/sec |
Minimum Component Size | 0402 mm |
Board Length | Min.25mm/Max.170mm |
Board Width | Min.17mm/Max.110mm |
Component Height Clearance (max) | 35mm |
Board Edge Clearance (min) | 5.0 mm |
Maximum Board Weight | 3 kg |
Maximum Board Warp | Up to +/- 3 mm |
Component Types Inspected | Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more |
Solder Joint Defects Categories | Solder bridge, opens, lifted leads, wettability, excess and insufficient solder, debris, and more |
Other Items Detected | Gold-finger contamination, pin-in-hole, bent pins, debris, and many others |
Component Measurement
Categories | Component X, Y position and Rotation |
| Vision System | |
|---|---|
Imagers | 80 Megapixel Sensor on each SIM module |
Image Transfer Protocol | PCIe |
Lighting | Strobe White Light (with dark/bright field) |
Resolution | 12 μm pixel size |
Image Processing | Statistical Appearance Modeling (SAM™ ) Technology.
Option: Autonomous Image Interpretation (AI²) Technology |
Programming | Simple inline or offline |
CAD Import | Any column separated text file (Standard information required - ref designator, XY, Angle, Part no.,) |
| Options | |
|---|---|
SPC Software | Alignment Target |
加入供应商
暂无设备
Copyright ©2025 深圳市五一表面贴装技术有限公司
联系电话：0755-27820151
地址：广东省深圳市宝安区航城大道159号航城创新创业园B2栋101