设备尺寸(W*D*H): 1000mmx1329mmx1531mm
设备重量: 950 lbs (430 kg)
电源要求: 110-220VAC, 50/60 Hz, 15 amps
气源要求: 60 PSI min., 1/4” air hose, 2 CFM
设备简介:YESTECH’s advanced multiple color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With dual sided top-down and bottom up viewing cameras, the FX-942 inspects solder joints and verifies correct part assembly enabling users to improve quality and enhance yields.展开更多
Specifications | |
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Throughput | Up to 30 sq. in./sec. > 1.5 million components per/year |
Maximum Board Size | 580mmx410mm |
Maximum Inspection Area | 495mmx395mm |
Clearance | 100mm top size
50mm bottom size |
Minimum Component Size | 01005 with high magnification option |
False Calls | <500 PPM (<0.05% typical) |
Defects Detected | Part: position, missing, wrong, polarity,
skew, tombstone
Lead: bent, lifted, bridging, pin measurement
Solder: open, insufficient, short, solder balls
Connectors: pin inspection |
Software | |
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Algorithms | Color, OCV, OCR, barcode recognition, both image and
rule-based algorithms. Optional 3D |
Data Requirements | ASCII Text, X-Y position, part , ref, polarity |
CAD Translation Package | Aegis, Fabmaster, YESTECH CAD Utility |
Programming Skill Level | Technician or operator |
Operating System | Windows 10 |
Off-line Software | Optional :
Rework, Review and Program Creation Basic |
SPC Software | Optional 1:
Rework, Review and Program Creation Basic
SPC Software: SPC included -
Optional 2:
Real-time local and remote
monitoring of first pass yield, defect trends, and
machine utilization. |
Data Outputs | Text, SQL, ODBC, MS Access, XML |
Hardware | |
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Material Handling | SMEMA, dual direction auto width conveyor,
pass / fail signals, board clamping |
Lighting | Proprietary Fusion Lighting™ multiangle LED |
Imager | Up to 5 megapixel color camera on each side using
22, 12 or 8 micron pixel size |
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