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诺信 Nordson SMT自动光学检查机 YESTECH FX-942 AOI

设备尺寸(W*D*H): 1000mmx1329mmx1531mm

设备重量: 950 lbs (430 kg)

电源要求: 110-220VAC, 50/60 Hz, 15 amps

气源要求: 60 PSI min., 1/4” air hose, 2 CFM

设备简介:YESTECH’s advanced multiple color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With dual sided top-down and bottom up viewing cameras, the FX-942 inspects solder joints and verifies correct part assembly enabling users to improve quality and enhance yields.展开更多

设备参数
设备文档
配件清单
Specifications
Throughput
Up to 30 sq. in./sec. > 1.5 million components per/year
Maximum Board Size
580mmx410mm
Maximum Inspection Area
495mmx395mm
Clearance
100mm top size 50mm bottom size
Minimum Component Size
01005 with high magnification option
False Calls
<500 PPM (<0.05% typical)
Defects Detected
Part: position, missing, wrong, polarity, skew, tombstone Lead: bent, lifted, bridging, pin measurement Solder: open, insufficient, short, solder balls Connectors: pin inspection
Software
Algorithms
Color, OCV, OCR, barcode recognition, both image and rule-based algorithms. Optional 3D
Data Requirements
ASCII Text, X-Y position, part , ref, polarity
CAD Translation Package
Aegis, Fabmaster, YESTECH CAD Utility
Programming Skill Level
Technician or operator
Operating System
Windows 10
Off-line Software
Optional : Rework, Review and Program Creation Basic
SPC Software
Optional 1: Rework, Review and Program Creation Basic SPC Software: SPC included - Optional 2: Real-time local and remote monitoring of first pass yield, defect trends, and machine utilization.
Data Outputs
Text, SQL, ODBC, MS Access, XML
Hardware
Material Handling
SMEMA, dual direction auto width conveyor, pass / fail signals, board clamping
Lighting
Proprietary Fusion Lighting™ multiangle LED
Imager
Up to 5 megapixel color camera on each side using 22, 12 or 8 micron pixel size
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