设备尺寸(W*D*H): 876mmx1010mmx1400mm
设备重量: 770 kg (1700 lbs)
电源要求: 100-240 VAC, 50/60 Hz, 10 amps
气源要求: 60 to 90 PSI (0.4 to 0.6 Mpa), 2 CFM
设备简介:Nordson YESTECH’s advanced megapixel technology offers high-speed PCB inspection with exceptional defect coverage. With high resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide, enabling users to improve quality and increase throughput.展开更多
Inspection Capabilities | |
---|---|
Throughput | > 3550 sq. mm/ sec (> 5.5 sq. in / second) |
Maximum Board Size | 350mm x 250mm |
Minimum Board Size | 50mm x 50mm |
Topside Clearance | 25mm |
Bottomside Clearance | 50mm |
Minimum Component Size | 01005 |
Defects Detected | Part: position, missing, wrong, polarity, skew
tombstone, etc.
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls |
Software | |
---|---|
Algorithms | Color, OCV, OCR, barcode recognition, both image and
rule-based algorithms |
Data Requirements | ASCII Text, X-Y position, part , ref, polarity |
CAD Translation Package | Aegis, Unicam, Fabmaster, YESTECH CAD Utility |
Programming Skill Level | Technician or operator |
Operating System | Windows XP Professional |
Off-line Software | Optional:
Rework, Review and Program Creation |
SPC Software | Optional:
Real-time local and remote monitoring of
first pass yield, defect trends, and machine utilization. |
Hardware | |
---|---|
Material Handling | SMEMA, dual direction auto width conveyor,
pass / fail signals, board clamping |
Conveyor Length | 876mm |
Conveyor Height | 950mm ± 35mm |
Lighting | Proprietary Fusion Lighting™ multiangle LED |
Imager | 3 megapixel color camera
Resolution 2048 x 1536; 20 or 12.5 micron pixel size |
Optics | Telecentric lens
(eliminates distortion for more accurate
and repeatable measurement and inspection results) |
Warpage Compensation | Optional |
Bottomside Barcode Reader | Optional |
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