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诺信 Nordson SMT自动光学检查机 M1 Series AOI

设备尺寸(W*D*H): 876mmx1010mmx1400mm

设备重量: 770 kg (1700 lbs)

电源要求: 100-240 VAC, 50/60 Hz, 10 amps

气源要求: 60 to 90 PSI (0.4 to 0.6 Mpa), 2 CFM

设备简介:Nordson YESTECH’s advanced megapixel technology offers high-speed PCB inspection with exceptional defect coverage. With high resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide, enabling users to improve quality and increase throughput.展开更多

设备参数
设备文档
配件清单
Inspection Capabilities
Throughput
> 3550 sq. mm/ sec (> 5.5 sq. in / second)
Maximum Board Size
350mm x 250mm
Minimum Board Size
50mm x 50mm
Topside Clearance
25mm
Bottomside Clearance
50mm
Minimum Component Size
01005
Defects Detected
Part: position, missing, wrong, polarity, skew tombstone, etc. Lead: bent, lifted, bridging Solder: open, insufficient, short, solder balls
Software
Algorithms
Color, OCV, OCR, barcode recognition, both image and rule-based algorithms
Data Requirements
ASCII Text, X-Y position, part , ref, polarity
CAD Translation Package
Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Programming Skill Level
Technician or operator
Operating System
Windows XP Professional
Off-line Software
Optional: Rework, Review and Program Creation
SPC Software
Optional: Real-time local and remote monitoring of first pass yield, defect trends, and machine utilization.
Hardware
Material Handling
SMEMA, dual direction auto width conveyor, pass / fail signals, board clamping
Conveyor Length
876mm
Conveyor Height
950mm ± 35mm
Lighting
Proprietary Fusion Lighting™ multiangle LED
Imager
3 megapixel color camera Resolution 2048 x 1536; 20 or 12.5 micron pixel size
Optics
Telecentric lens (eliminates distortion for more accurate and repeatable measurement and inspection results)
Warpage Compensation
Optional
Bottomside Barcode Reader
Optional
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