设备尺寸(W*D*H): 915mmx1074mmx1494mm
设备重量: 770 kg (1700 lbs)
电源要求: 100-240 VAC, 50/60 Hz, 10 amps
气源要求: 60 to 90 PSI (0.4 to 0.6 Mpa), 2 CFM
设备简介:The M2 offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submircon levels and telecentric optics, the M2 provides completeinspection, all within a footprint less than 1 sq. meter. 展开更多
Inspection Capabilities | |
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Throughput | 75-125 mm² /sec |
Maximum inspection area | 356mm×320mm×25mm |
Device types | JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA, MEMs, waffle packs |
Defects Detected | |
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Wires | Missing, damaged, no stick, off pad, club foot, lifted |
Die | Missing, wrong, polarity, chipped, cracked, contamination |
Part | Position, missing, wrong, polarity, skew, tombstone |
Epoxy | Contamination, insufficient, excessive, bridging |
Solder | Contamination, insufficient, excessive, bridging |
Software | |
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Algorithms | Color, OCV, OCR, barcode recognition, both image and rule-based algorithms |
Data requirements | ASCII Text, X-Y position, part , ref, polarity |
CAD translation package | Aegis, Unicam, Fabmaster, YESTECH CAD Utility |
Operating system | Windows 10 |
Off-line software | Optional:
Rework, review and program creation |
SPC software | Optional:
Real-time local and remote Vudata package |
Hardware | |
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Material handling | SMEMA width conveyor, pass / fail signals, board clamping |
Conveyor length | 915 mm |
Conveyor height | 950mm ± 35 mm |
Lighting | Proprietary Fusion Lighting™ multiangle LED |
Imaging | M2 Basic: Dual 5 megapixel color camera (0.34 to 9 micron pixel size) resolution 2448 × 2048
M2 Ultra 3D: 5 cameras Ultra High resolution 3D sensor option |
Optics | Proprietary high resolution, low distortion with coaxial illumination and optional FV Metrology module |
AFVM - Metrology module | FVM - Focus Variation Measurement sensor |
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