诺信Nordson SMT自动光学检测机YESTECH M2
设备尺寸(W*D*H): L1074×W915×H1494mm
设备重量: 770kg
电源要求: AC100~240V 50/60Hz
气源要求: 0.4~0.6MPa, 57L/min
设备简介:诺信YESTECH（现Test & Inspection）M2为面向微电子与半导体封装的在线AOI，可检引线键合、芯片贴装、SMT元件与基板，支持JEDEC托盘、料条及引线框架，配NYTVision软件。注意与Nordson SQ3000M2（110×128×143cm、965kg）区分，本机为915×1074×1494mm、770kg，平台记录一致。展开更多
设备参数
设备文档
配件清单
设备参数
| Inspection Capabilities | |
|---|---|
Throughput | 75-125 mm² /sec |
Maximum inspection area | 356mm×320mm×25mm |
Device types | JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA, MEMs, waffle packs |
| Defects Detected | |
|---|---|
Wires | Missing, damaged, no stick, off pad, club foot, lifted |
Die | Missing, wrong, polarity, chipped, cracked, contamination |
Part | Position, missing, wrong, polarity, skew, tombstone |
Epoxy | Contamination, insufficient, excessive, bridging |
Solder | Contamination, insufficient, excessive, bridging |
| Software | |
|---|---|
Algorithms | Color, OCV, OCR, barcode recognition, both image and rule-based algorithms |
Data requirements | ASCII Text, X-Y position, part , ref, polarity |
CAD translation package | Aegis, Unicam, Fabmaster, YESTECH CAD Utility |
Operating system | Windows 10 |
Off-line software | Optional:
Rework, review and program creation |
SPC software | Optional:
Real-time local and remote Vudata package |
| Hardware | |
|---|---|
Material handling | SMEMA width conveyor, pass / fail signals, board clamping |
Conveyor length | 915 mm |
Conveyor height | 950mm ± 35 mm |
Lighting | Proprietary Fusion Lighting™ multiangle LED |
Imaging | M2 Basic: Dual 5 megapixel color camera (0.34 to 9 micron pixel size) resolution 2448 × 2048
M2 Ultra 3D: 5 cameras Ultra High resolution 3D sensor option |
Optics | Proprietary high resolution, low distortion with coaxial illumination and optional FV Metrology module |
AFVM - Metrology module | FVM - Focus Variation Measurement sensor |