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诺信 Nordson SMT自动光学检查机 YESTECH M2

设备尺寸(W*D*H): 915mmx1074mmx1494mm

设备重量: 770 kg (1700 lbs)

电源要求: 100-240 VAC, 50/60 Hz, 10 amps

气源要求: 60 to 90 PSI (0.4 to 0.6 Mpa), 2 CFM

设备简介:The M2 offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submircon levels and telecentric optics, the M2 provides completeinspection, all within a footprint less than 1 sq. meter. 展开更多

设备参数
设备文档
配件清单
Inspection Capabilities
Throughput
75-125 mm² /sec
Maximum inspection area
356mm×320mm×25mm
Device types
JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA, MEMs, waffle packs
Defects Detected
Wires
Missing, damaged, no stick, off pad, club foot, lifted
Die
Missing, wrong, polarity, chipped, cracked, contamination
Part
Position, missing, wrong, polarity, skew, tombstone
Epoxy
Contamination, insufficient, excessive, bridging
Solder
Contamination, insufficient, excessive, bridging
Software
Algorithms
Color, OCV, OCR, barcode recognition, both image and rule-based algorithms
Data requirements
ASCII Text, X-Y position, part , ref, polarity
CAD translation package
Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Operating system
Windows 10
Off-line software
Optional: Rework, review and program creation
SPC software
Optional: Real-time local and remote Vudata package
Hardware
Material handling
SMEMA width conveyor, pass / fail signals, board clamping
Conveyor length
915 mm
Conveyor height
950mm ± 35 mm
Lighting
Proprietary Fusion Lighting™ multiangle LED
Imaging
M2 Basic: Dual 5 megapixel color camera (0.34 to 9 micron pixel size) resolution 2448 × 2048 M2 Ultra 3D: 5 cameras Ultra High resolution 3D sensor option
Optics
Proprietary high resolution, low distortion with coaxial illumination and optional FV Metrology module
AFVM - Metrology module
FVM - Focus Variation Measurement sensor
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