美芯MIRTEC（在线）SPI检测机MS—11 3D SPI Series
设备尺寸(W*D*H): L1270×W1680×H1500mm
设备重量: 1200kg
电源要求: 单相 AC200~240V 50/60Hz
气源要求: 0.5MPa
设备简介:MIRTEC（美陆）MS-11 3D SPI 系列，采用15MP CoaXPress 相机、双投影无阴影摩尔纹相移技术、复合远心镜头，具自动Z轴校高、PCB下支撑与板弯补偿，可与印刷机闭环通讯并接入 INTELLISYS 智慧工厂系统。尺寸/重量/电源/气源取自 MIRTEC 官方数据表 REV1（MS-11U：1270W×1680D×1500H、1200kg），与平台原值一致。展开更多
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| System Specifications | |
|---|---|
PCB Inspection Area(LxW) | 60x60mm~660x610mm |
PCB Indexing Mode(LxW) | 60x60mm~1,320x610mm |
| Vision System (FOV Size) | |
|---|---|
15MP CoaXPress | 3,904 x 3,904 @120fps |
Pixel Resolution(15um) | 58.56mmx58.56mm(2.31”x2.31”) |
Pixel Resolution(10um) | 39.04mmx39.04mm(1.54”x1.54”) |
| Inspection Technology | |
|---|---|
3D Inspection Technology | Dual Projection Shadow Free Moiré Phase Step Image Processing |
2D Inspection Technology | 15MP CoaXPress Camera System |
Height Resolution | ±1 um |
Height Accuracy on Calibration Fixture | ± 1% |
Repeatability on Calibration Fixture | Height:±1% / Volume:±2% |
Inspection Height | Maximum:500um/Minimum:40um |
3D Inspection Item | Solder Deposition: Height, Volume / Area, Solder Bridge, X/Y Offset, Shape Deformity, etc |
| Additional Specifications | |
|---|---|
Lens Configuration | Precision Telecentric Compound Lens Design |
Lighting System | Advanced High-Intensity RGB LED Lighting System |
PCB Surface Clearance | Top-Side Clearance: 20mm/Bottom-Side Clearance:50mm |
PCB Edge Clearance | Top-Edge Clearance: 3mm/Bottom-Edge Clearance: 3.5mm |
Maximum PCB Warpage | ±2 mm |
Maximum PCB Weight | 4 Kg(8.82 Lbs.) |
PCB Thickness Range | 0.5mm~5mm |
Robot Positioning System | Precision Closed Loop AC Servo Drive, Resolution:1um/ Repeatability±10um |