美陆 MIRTEC SMT自动光学检查机 MV-3 OMNI
设备尺寸(W*D*H): 1005x1200x1520mm
设备重量: 350Kg
电源要求: Single Phase 200~240V 50~60Hz; 1.1 KW
气源要求: 5KGf/cm²（0.5Mpa）
设备简介:2D检测:采用8段同轴彩色照明能获得清晰的图像;使用多种彩色照明，能精确检测焊锡;使用同轴照明，能检查到CSP反光体的微细裂纹检查 ;通过各种照明调整，完美的OCR和波峰焊检查;.超精密3D检测:2500万/1500万像素相机和分辨率7.7um镜头，最小检测元件尺寸(0201㎜/008004inch).展开更多
设备参数
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配件清单
| 规格参数 | |
|---|---|
PCB Size | 50x50~450x390mm |
| OMNI-VISION 3D/2D Inspection Technology | |
|---|---|
3D Inspection Technology | Digital 8 Projection Moire Technology |
Height Accuracy | ±3μm |
| 3D/2D Maximum Inspection Speed | ||
|---|---|---|
25 Megapixel Camera [CXP] | 7.7μm | 1,460mm²/Sec |
15 Megapixel Camera [CXP] | 15μm/10μm | 4,260mm²/Sec;
1,890mm²/Sec |
| System Specification | |
|---|---|
Lighting System | 8 Phase Coaxial Color Lighting System |
Side Camera System [Option] | 18/10 Megapixel Digital Color Side Cameras (4ea) |
Software | Standard:Built-in SPC, Built-in Repair,Smart Debugger;
Option:RRS,IRS, OLTT, SPC Server System, ePM-AOI |
PCB Thickness | 0.5~3mm(Option:0.5~5mm) |
Dimension and Weight | Include Work Table |
| Min measurement Size | ||
|---|---|---|
25 Megapixel Camera | 7.7μm | 0201Chip(mm)/0.3 Pitch(mm) |
15 Megapixel Camera | 15μm | 0603Chip(mm)/0.4 Pitch(mm) |
15 Megapixel Camera | 10μm | 03015Chip(mm)/0.3 Pitch(mm) |
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