美陆MIRTEC SMT自动光学检查机MV-3全向
设备尺寸(W*D*H): L1200×W1005×H1520mm
设备重量: 350kg
电源要求: 单相 AC200~240V 50/60Hz
气源要求: 0.5MPa
设备简介:韩国美陆（MIRTEC）MV-3 OMNI 桌面式3D AOI，OMNI-VISION数字三频摩尔+8段同轴彩色照明，主相机15/25MP CoaXPress、可选4路侧视相机，2D缺陷（缺件、偏移、立碑、桥连）与3D（翘脚、少锡、多锡、虚焊）并检，支持AI自动编程。平台记录1005(W)×1200(D)×1520mm/350kg 与代理商规格表一致（含工作台），已按长×宽×高重排；原厂数据表裸机为975×1300×790mm/200kg（REV5）、990×1430×1600mm/600kg（REV7），版本与配置差异待核实，暂保留原值。展开更多
设备参数
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设备参数
| 规格参数 | |
|---|---|
PCB Size | 50x50~450x390mm |
| OMNI-VISION 3D/2D Inspection Technology | |
|---|---|
3D Inspection Technology | Digital 8 Projection Moire Technology |
Height Accuracy | ±3μm |
| 3D/2D Maximum Inspection Speed | ||
|---|---|---|
25 Megapixel Camera [CXP] | 7.7μm | 1,460mm²/Sec |
15 Megapixel Camera [CXP] | 15μm/10μm | 4,260mm²/Sec;
1,890mm²/Sec |
| System Specification | |
|---|---|
Lighting System | 8 Phase Coaxial Color Lighting System |
Side Camera System [Option] | 18/10 Megapixel Digital Color Side Cameras (4ea) |
Software | Standard:Built-in SPC, Built-in Repair,Smart Debugger;
Option:RRS,IRS, OLTT, SPC Server System, ePM-AOI |
PCB Thickness | 0.5~3mm(Option:0.5~5mm) |
Dimension and Weight | Include Work Table |
| Min measurement Size | ||
|---|---|---|
25 Megapixel Camera | 7.7μm | 0201Chip(mm)/0.3 Pitch(mm) |
15 Megapixel Camera | 15μm | 0603Chip(mm)/0.4 Pitch(mm) |
15 Megapixel Camera | 10μm | 03015Chip(mm)/0.3 Pitch(mm) |