美锐MIRTEC SMT自动光学检测机MV—2GT
设备尺寸(W*D*H):
设备重量:
电源要求:
气源要求:
设备简介:
设备参数
设备文档
配件清单
设备参数
| 规格参数 | |
|---|---|
PCB Size | 50x50~510x400mm |
PCB Thickness | 0.5~3mm |
Main Camera(5Mega) | 2456x2058 Pixels |
FOV/Resolution | 32.9x27.6mm/13.4µm/pixel |
Inspection Speed | 3,492mm²/sec(0.26sec/frame) |
Smallest Component inspection | 0201Chip/0.3pitch IC(mm） |
inspection ltem | Lift Component,Lift Lead,Flipped Component, Excessive Solder, Open Solder, Missing Component, Shift, Skew Component, Polarity, Tombstone,Solder Ball, Foreign Component, QFP/BGA Package, Flied Component Under The QFP/BGAPackage,Tumover |
Robot Driven System | Cosed Loop Stepping System |
Lighting Syaten | 3Layer LED (Horizontal. Vertical, Coaxial). Quad Angle Lighting System |
PC | 19'' LCD Monitor. Windows XP Professional |
Environment | Temperature:0~40°C,Humidity:30~80% RH |