设备尺寸(W*D*H): 1000 mm x 1615 mm x 1055 mm
设备重量: 800kg
电源要求: 230 V /50 / 60 Hz, ± 10 %
气源要求: 0.5±0.05Mpa
设备简介: S6053BO-V 通过结合现代化的 3D 测量技术和其在金线检测行业的多年经验,来为您的产品提供安全保障。在处理高反射率金线时,除了知名的条纹投影设备,我们还使用了复杂成像技术。这也为粘合流程提供了可靠的质量保证。无论是何种粗细的金线还是带状焊丝,Viscom 的检测算法都将给予其相同的检测精度。我们久经考验的 2D 和 3D 金线检测系统也能很好地集成在任何复杂的网络环境中。展开更多
参数 | |
---|---|
Inspection | concept Single inspection |
Number of cameras
| 1 |
Pixel size | 4.5 μm/pixel |
User interface | Viscom EasyPro |
SPC | Viscom SPC (statistical process control), open interface (optional) |
Verification station | Viscom HARAN |
Remote diagnosis | Viscom SRC (software remote control) (optional) |
Programming station | Viscom PST34 (optional) |
Operating system | Windows |
Processor | Intel® Core™ i7 |
Max. substrate size | 280 mm x 300 mm |
Transport clearance | 860 - 1180 mm ± 20 mm |
Substrate clamping | Vacuum or mechanical clamping |
Upper transport clearance | Up to 35 mm |
Interfaces | SMEMA, SV70, customer-specific |
Positioning/handling unit | Synchronous linear motors |
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