库力索法Kulicke&SOFA自动焊锡机ATPREMIER PLUS
设备尺寸(W*D*H): 780 mm wide x 1118 mm deep (31” x 41”)
设备重量: 680 kg (1499 lbs)
电源要求: 200 to 240 VAC; - 15 % to + 10 %
气源要求: 185 liters / min @ 4.6 kg / sq cm (6.5 CFM @ 65 psi)
设备简介:The ATPremierPS PLUSTM is another extension of the successful Power Series platform. The superior wafer level stud bumping and wire bonding of the ATPremier PLUS delivers high productivity with increased efficiency. The ATPremierPS PLUSTM 作为 “力” 系列焊接设备的又一力作，带来出色的晶圆级植球和线焊工艺，从而进一步提升产能和效率产品展开更多
设备参数
设备文档
配件清单
设备参数
| PROCESS CAPABILITY | |
|---|---|
Pitch | 50 μm in-line @ 3 sigma |
Total Bond Placement Accuracy | ± 3.5 μm @ 3 sigma (200 mm work piece)
± 5.0 μm @ 3 sigma (300 mm work piece) |
Standard User Processes | Standard Bump
AccuBump
Stack Bump |
Bump Height Variation | AccuBump: ± 3 μm @ 3 sigma
Standard Bump: ± 15 um @ 3 sigma |
Maximum Wire Length | 5.0 mm |
Minimum Loop Height | 100 μm Forward Loop
70 μm SSB (reverse loop) |
Wire Sway | Wire Length < 2.54 mm: 25 μm @ 3 sigma
Wire Length > 2.54 mm: ± 1 % wire length @ 3 sigma |
| MAN-MACHINE INTERFACE | |
|---|---|
Monitor | 17” color LCD display |
Durable control panel | with function keys and dedicated buttons, and
user-friendly mouse |
Compatibility | ATPremier bond programs are upwardly compatible |
Industry-Recognized user interface | Simple pull-down menus. Color-overlays of wire
groups for easy programming and teach |