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德律 TRI (在线)SPI锡膏检查机 TR7007Q Plus

设备尺寸(W*D*H): TR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm

设备重量: TR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm

电源要求: 200-240VAC

气源要求: 72psi-87psi

设备简介:TR7007Q Plus 3D SPI平台配备了优化的运动控制系统(EtherCat)和強化的2D光源模组,可以准确地检测低锡桥缺陷及进行板弯补偿以消除PCB制程误差。 TR7007Q Plus可配备多达4組数位条纹光投影,以确保进行无阴影检测。 SPI解决方案简化了生产线和MES之间的数据交换流程,实现生产线连接数据的可追溯性。展开更多

设备参数
设备文档
配件清单
参数表
项目
规格
Imaging Method
Stop-and-Go Imaging
Camera
4 Mpix or 12 Mpix (factory setting)
Imaging Resolution
5.5 μm, 6 μm, 10 μm , 15 µm (factory setting)
Lighting
Enhanced 2D Lights (RGB+W)
3D Technology
4-way Digital Fringe Pattern
Field of View
4 Mpix@ 10 µm: 20.3 x 20.3 mm //4 Mpix@ 15 µm: 30.5 x 30.5 mm //12 Mpix Camera Link@ 5.5 µm*: 22.5x16.5 mm //12 Mpix Camera Link@ 10 µm: 40.8x30.7 mm //12 Mpix Camera Link@ 15 µm: 61.2x46.1 mm //12 Mpix CoaXPress@ 6 µm*: 24.4x18.4 mm //12 Mpix CoaXPress@ 10 µm: 40.8x30.7 mm // * 5.5 μm and 6 μm are not available for TR7007Q Plus DL
Imaging Speed
Up to 3 FOV/sec
Height Resolution
0.45 μm
Max. Solder Height
420 μm/840 μm
X-Axis Control
Ballscrew + EtherCAT motion controller
Y-Axis Control
Ballscrew + EtherCAT motion controller
Z-Axis Control
Ballscrew + EtherCAT motion controller
X-Y Axis Resolution
0.5 μm
Z-Axis Resolution
1 µm
Max PCB Size
TR7007Q Plus: @5.5 & 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm TR7007Q Plus DL: @10 & 15 μm - 510 x 310 mm x 2 Lanes, 510 x 590 mm x 1 Lane
PCB Thickness
0.6 - 5mm
Max PCB Weight
3kg. Optional: 5kg
Top Clearance
@5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm
Bottom Clearance
40 mm
Edge Clearance
3mm
Conveyor Height
880 – 920 mm * SMEMA Compatible
Defects
Insufficient Paste /Excessive Paste /Shape Deformity /Missing Paste & Bridging
Measurement
Height Area Volume Offset
WxDxH
TR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 515 mm
Weight
TR7007Q Plus: 750 kg TR7007Q Plus DL: 830 kg
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