德律TRI(在线)SPI锡膏检查机TR7007Q Plus
设备尺寸(W*D*H):
设备重量: 750kg
电源要求:
气源要求:
设备简介:德律科技（TRI，台湾）TR7007Q Plus为3D锡膏检查机，采用EtherCAT运动控制与强化2D光源，最多4组数字条纹光投影实现无阴影检测，可检出低锡桥并作板弯补偿；支持SPC与MES数据交换，适配SMEMA连线与智能工厂追溯。平台重量字段误填为尺寸字符串，原厂单轨机型约750kg（双轨DL型830kg）。展开更多
设备参数
设备文档
配件清单
设备参数
| 参数表 | |
|---|---|
项目 | 规格 |
Imaging Method | Stop-and-Go Imaging |
Camera | 4 Mpix or 12 Mpix (factory setting) |
Imaging Resolution | 5.5 μm, 6 μm, 10 μm , 15 µm (factory setting) |
Lighting | Enhanced 2D Lights (RGB+W) |
3D Technology | 4-way Digital Fringe Pattern |
Field of View | 4 Mpix@ 10 µm: 20.3 x 20.3 mm //4 Mpix@ 15 µm: 30.5 x 30.5 mm //12 Mpix Camera Link@ 5.5 µm*: 22.5x16.5 mm //12 Mpix Camera Link@ 10 µm: 40.8x30.7 mm //12 Mpix Camera Link@ 15 µm: 61.2x46.1 mm //12 Mpix CoaXPress@ 6 µm*: 24.4x18.4 mm //12 Mpix CoaXPress@ 10 µm: 40.8x30.7 mm // * 5.5 μm and 6 μm are not available for TR7007Q Plus DL |
Imaging Speed | Up to 3 FOV/sec |
Height Resolution | 0.45 μm |
Max. Solder Height | 420 μm/840 μm |
X-Axis Control | Ballscrew + EtherCAT motion controller |
Y-Axis Control | Ballscrew + EtherCAT motion controller |
Z-Axis Control | Ballscrew + EtherCAT motion controller |
X-Y Axis Resolution | 0.5 μm |
Z-Axis Resolution | 1 µm |
Max PCB Size | TR7007Q Plus: @5.5 & 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm TR7007Q Plus DL: @10 & 15 μm - 510 x 310 mm x 2 Lanes, 510 x 590 mm x 1 Lane |
PCB Thickness | 0.6 - 5mm |
Max PCB Weight | 3kg. Optional: 5kg |
Top Clearance | @5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3mm |
Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Defects | Insufficient Paste /Excessive Paste /Shape Deformity /Missing Paste & Bridging |
Measurement | Height Area Volume Offset |
WxDxH | TR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 515 mm |
Weight | TR7007Q Plus: 750 kg TR7007Q Plus DL: 830 kg |