Kulicke & Soffa SMD提供贴片器iX 302/iX 502 with Tapes
Equipment Size (W*D*H): 2,760 x 2,187 mm(iX 302) ,3,720 x 2,187 mm(iX502)
Equipment Weight:
Power Requirements:
Air Source Requirements:
Equipment Introduction:The K&S iX has continuous enhancements in the total pick and place process, further introducing a new light weight feeding range with proven high field-measured pick-rates of over 99.99%, higher placement accuracies for passives (35 microns), new component range, 25% increased output for camera-aligned components.With software optimizing factory processes efficiently, the iX 302 and iX 502 simply blends into your factory. Show More
Equipment Parameters
Equipment Documents
Parts List
Equipment Parameters
| Specifications | ||
|---|---|---|
iX302 | iX502 | |
Maximum output per hour | 99k cph | 165k cph |
Maximum output IPC9850/IPC9850A
(passives + actives) | 79k cph | 121k cph |
Placement accuracy @ Cpk>1 | 25 mm for Passives
20 mm for Flip Chips / Dies | 25 mm for Passives
20 mm for Flip Chips / Dies |
Min. component size | 0.25 x 0.125 mm (008004, 0201M) | 0.25 x 0.125 mm (008004, 0201M) |
Max. component size | 45 x 45 mm (1.77 x 1.77”) | 45 x 45 mm (1.77 x 1.77”) |
Max. component height | 10.5 mm (taller on request) | 10.5 mm (taller on request) |
Programmable placement force
(in steps of 0.1 N) | 0.5 - 8 N | 0.5 - 8 N |
Min. board size: | 50 x 50 mm (2 x 2”)
(50 x 25 mm (2 x 1”) on request) | 50 x 50 mm (2 x 2”)
(50 x 25 mm (2 x 1”) on request) |
Max. board size:
- Standard
- Optional board width
- Optional board length | 475 x 390 mm (18.7 x 15.35”)
457 mm (18”)
800 mm (31.5”) | 515 x 390 mm (20.28 x 15.35”)
457 mm (18”)
800 mm (31.5”) (1500 mm on request) |
Board thickness | 0.3 to 6 mm (10 mm on request) | 0.3 to 6 mm (10 mm on request) |
Max. tape feeding lanes
(8 mm- SF feeders) | 126 | 210 |