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库力索法 Kulicke & Soffa SMD供料器 iX302/iX502 with Tapes

设备尺寸(W*D*H): 2,760 x 2,187 mm(iX 302) ,3,720 x 2,187 mm(iX502)

设备重量:

电源要求:

气源要求:

设备简介:The K&S iX has continuous enhancements in the total pick and place process, further introducing a new light weight feeding range with proven high field-measured pick-rates of over 99.99%, higher placement accuracies for passives (35 microns), new component range, 25% increased output for camera-aligned components.With software optimizing factory processes efficiently, the iX 302 and iX 502 simply blends into your factory. 展开更多

设备参数
设备文档
配件清单
Specifications
iX302
iX502
Maximum output per hour
99k cph
165k cph
Maximum output IPC9850/IPC9850A (passives + actives)
79k cph
121k cph
Placement accuracy @ Cpk>1
25 mm for Passives 20 mm for Flip Chips / Dies
25 mm for Passives 20 mm for Flip Chips / Dies
Min. component size
0.25 x 0.125 mm (008004, 0201M)
0.25 x 0.125 mm (008004, 0201M)
Max. component size
45 x 45 mm (1.77 x 1.77”)
45 x 45 mm (1.77 x 1.77”)
Max. component height
10.5 mm (taller on request)
10.5 mm (taller on request)
Programmable placement force (in steps of 0.1 N)
0.5 - 8 N
0.5 - 8 N
Min. board size:
50 x 50 mm (2 x 2”) (50 x 25 mm (2 x 1”) on request)
50 x 50 mm (2 x 2”) (50 x 25 mm (2 x 1”) on request)
Max. board size: - Standard - Optional board width - Optional board length
475 x 390 mm (18.7 x 15.35”) 457 mm (18”) 800 mm (31.5”)
515 x 390 mm (20.28 x 15.35”) 457 mm (18”) 800 mm (31.5”) (1500 mm on request)
Board thickness
0.3 to 6 mm (10 mm on request)
0.3 to 6 mm (10 mm on request)
Max. tape feeding lanes (8 mm- SF feeders)
126
210
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