库力索法Kulicke和Soffa自动焊锡机快速专业版

设备尺寸(W*D*H): 889 mm wide x 1009 mm deep (35” x 39.7”)

设备重量: 590 kg (1300 lbs)

电源要求: 200 - 240 VAC; - 15% to + 10%

气源要求: 185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)

设备简介:RAPID™ Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications. RAPID™ Pro 引入了先进的工艺能力、实时监控和诊断，以确保为高性能和高可靠性半导体应用提供最佳质量和高效的组装。展开更多

设备参数

设备文档

配件清单

WIRE BONDING CAPABILITY
Ultra Fine Pitch	35 μm inline bond pad pitch
Wire Size	0.6 mil to 2.5 mil copper, silver, or gold wire
Bonding Area	X Axis: 56 mm Y Axis: 80 mm (Standard), 87 mm (LA), 90 mm (ELA)
Total Bond Placement Accuracy	2.0 μm @ 3 sigma
Pattern Recognition/Optics/Vision	Higher Resolution Progressive Scan Vision System CCD Camera • Dual Magnification Optics (standard: 2x & 6x) • Optional Programmable Focus for High Magnification

LOOPING CAPABILITY
Maximum Wire Length	7.6 mm with 1.0 mil wire 3.0 mm with 0.6 mil wire
Minimum Loop Height	Ultra-low loop with Power Series Low Loop 40 μm with 0.6 mil wire
Wire Sway	Wire length < 2.54 mm: 25 μm @ 3 sigma Wire length > 2.54 mm: ± 1% wire length @ 3 sigma

Conversion times
Same Leadframe Type:	‹ 4 min
Dierent Leadframe Type:	‹ 8 min

MAN-MACHINE INTERFACE
Monitor	21.5" color LCD display
Durable control panel	Function keys and dedicated buttons, and user-friendly mouse.
Industry-Recognized user interface	Simple pull-down menus. Color-overlays of wire groups for easy programming and teach.