库力索法Kulicke&Soffa自动焊锡机小行星
设备尺寸(W*D*H): 683mm (W) x 1500mm (D) x 1833mm (H)
设备重量: 730kg Uncrated
电源要求: 180-240VAC, Single Phase, 50/60Hz, 2.0kVA
气源要求: Min 275kPa - Max 1000kPa, 2-10 L/min
设备简介:The Asterion™ wedge bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together, these deliver heightened productivity, bonding quality, and reliability. Asterion™ 楔焊机拥有扩大的焊接区域、稳健的图形识别能力和更为严格的工艺控制，这些增强的功能带来更高的生产力、焊接质量和可靠性。展开更多
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| Specifications • Newly designed Graphical Bond head Set-up aid option (GBS) reduces consumable replacement time & ensures a repeatable set-up • Bond Process Monitoring option (BPM) helps keep tight control of the bonding process • SECS-GEM option enables factory automation and communication • Off-line Programming Tool (OPT) creates bonder programs from CAD drawings • Programmable status light can be programmed for customized conditions Options Interconnect O | |
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Motion System | X,Y Axes: Linear motors, 0.1μm Resolution
Bond Area: 300mm x 300mm
Z-Axis: Voice Coil, 0.1μm Resolution; 50mm Z-Stroke
Θ-Axis: Direct Drive; ± 220°, 0.0057° Resolution
Repeatability: ±3.0μm at 3σ |
Pattern Recognition/Optics/Vision | Vision System: GS4 Pattern Recognition System
New PR Modes: Feature Find, Single Point with Angle, Geomodel |
Interconnect Options | Large Wire
Wire Range: 100μm - 500μm Diameter
PowerRibbon
Ribbon Range: 500 x 100μm to 2000 x 250μm
Small Wire
Wire feed angle: 45° or 60°
Wire Range: 25μm - 75μm Diameter |
Material Handler | Handler Bay:
With Insert: 710mm (D) x 225mm (H)
Open Bay: 710mm (D) x 460mm (H)
Standard Integrated Handlers Available |