设备尺寸(W*D*H): 800 (W) x 1971 (D) x 1955 mm (H)
设备重量: 1015 kg Uncrated without work holder insert
电源要求: 180 - 240 VAC, Single Phase, 50/60 Hz, 2.0 kVA
气源要求: Min 275 kPa - Max 1000 kPa, 2-10 L/min
设备简介:The Asterion™ EV (Extended Version) wedge bonder is built on a reengineered architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. 展开更多
Features | |
---|---|
Battery Bonding | ▪ Compensation for height variations between surfaces
▪ Real-time physical testing with the non-destructive pull tester
▪ Self-contained/Built-in wire feed dispensing system
▪ No heat applied, all work done at ambient temperatures |
Productivity | ▪ Large bondable area (300 mm x 860 mm) reduces indexing/loading time
▪ Resistive touchscreen monitor |
Performance | ▪ Consistent process results |
Consistent process results | ▪ Single platform offering a range of interconnect solutions for Al and Cu wires —
Large wire, small wire and PowerRibbonTM with a wide range of bond head selection
▪ Supports multi-device and multi-lane automated handler |
Ease of Use | Intuitive Graphical User Interface (Windows 7 OS) |
Maintenance and Reliability - Lower Cost-of-Ownership | ▪ Highly reliable direct-drive XYZT motion system requires no adjustments and less
frequent preventive maintenance
▪ Reduced preventive maintenance requirements on major components |
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