库力索法 Kulicke & Soffa 贴片机 HYBRID SIP
设备尺寸(W*D*H): 2,760 x 2,187 mm(Hybrid3),3,720 x 2,187 mm(Hybrid5)
设备重量:
电源要求:
气源要求:
设备简介:The K&S Hybrid is the first hybrid Flip Chip/passive placement machine with the speed and accuracy needed for cost-effective SiP manufacture. K&S Hybrid 设备是业界第一台既可操作 Flip Chip 又能进行被动元件放置的高速度和高准确度设备，为SiP生产带来节约成本的解决方案。 展开更多
设备参数
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配件清单
| Specifications | ||
|---|---|---|
Hybrid3 | Hybrid5 | |
Maximum output per hour | 99k cph | 165k cph |
Maximum output
IPC9850/IPC9850A | 79k cph | 121k cph |
Placement accuracy @ Cpk>1 | 15 mm for Passives
7 mm for Flip Chips / Dies | 15 mm for Passives
7 mm for Flip Chips / Dies |
Min. component size | 0.25 x 0.125 mm (008004, 0201M) | 0.25 x 0.125 mm (008004, 0201M) |
Max. component size | 45 x 45 mm (1.77 x 1.77”) | 45 x 45 mm (1.77 x 1.77”) |
Max. component height | 10.5 mm (taller on request) | 10.5 mm (taller on request) |
Programmable placement force
(in steps of 0.1 N) | 0.5 - 8 N | 0.5 - 8 N |
Board thickness | 0.3 to 6 mm (10 mm on request) | 0.3 to 6 mm (10 mm on request) |
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