设备尺寸(W*D*H): 889 mm wide x 1009 mm deep (35” x 39.7”)
设备重量: 590 kg (1300 lbs) (machine only)
电源要求: 200 - 240 VAC; -15 % to + 10%
气源要求: 185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)
设备简介:IConnPS PLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need — for Wire Bonding today, PLUS tomorrow. IConn PLUS 作为业界最新的全自动高性能焊线机, 配备强化了的子系统,其全面的焊接能力将助您轻松应对当今和未来的线焊应用挑战。展开更多
WIRE BONDING CAPABILITY | |
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Ultra Fine Pitch for Au Wire | 35 μm inline @ 3 sigma |
Bonding Area | X Axis: 56 mm
Y Axis: 80 mm |
Total Bond Placement Accuracy | 2.0 μm @ 3 sigma |
Pattern Recognition/Optics/Vision | Progressive Scan Vision Engine CCD Video Camera |
Standard User Processes | Compatible with all Legacy Processes
Power Series Advanced Loop
Power Series Low Loop |
LOOPING CAPABILITY | |
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Maximum Wire Length | 7.6 mm with 1.0 mil wire
3.0 mm with 0.6 mil wire |
Minimum Loop Height | Ultra-low loop with Power Series Low Loop
40 μm with 0.6 mil wire |
Wire Sway | Wire length < 2.54 mm: 25 μm @ 3 sigma
Wire length > 2.54 mm: ± 1 % wire length @ 3 sigma |
Conversion times | |
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Same Leadframe Type: | < 4 min |
Different Leadframe Type: | < 8 min |
MAN-MACHINE INTERFACE | |
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Monitor | 17” color LCD display |
Durable Control Panel | Function keys and dedicated buttons, and
user-friendly mouse. |
Industry-Recognized User Interface | Simple pull-down menus. Color-overlays of wire
groups for easy programming and teach. |
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