德律 TRI （在线）SPI锡膏检查机 TR7007 SII Ultra
设备尺寸(W*D*H): TR7007 SII Ultra: 1100 x 1480 x 1600 TR7007 SII Ultra DL: 1100 x 1705 x 1600 mm
设备重量: TR7007 SII Ultra: 1100 x 1480 x 1600 TR7007 SII Ultra DL: 1100 x 1705 x 1600 mm
电源要求:
气源要求:
设备简介:TR7007 SII Ultra 的检测速度在业界中处于领先地位，最 高可达 180 cm2/sec，建立在强化的机械平台上，可确保检测过程中的稳定度、准确性和精确性。TR7007 SII Ultra 3D SPI 亦是一项工业4.0解决方案，可支持即将推出的创新协议，例如IPC Connected Factory Exchange（CFX）和IPC Hermes 9852标准。展开更多
设备参数
设备文档
配件清单
| 参数表 | |
|---|---|
项目 | 规格 |
Imaging Method | Dynamic Imaging |
Camera | 4 Mpix |
Imaging Resolution | 10 μm, 15 µm (factory setting) |
Lighting | RGB LED |
3D Technology | 2-way Fringe Pattern |
Field of View | 4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm |
Imaging Speed | 4 Mpix@ 10 µm: 80 cm²/sec 4 Mpix@ 15 µm: 180 cm²/sec |
Height Resolution | 0.4 µm |
Max. Solder Height | @ 10 µm: 420 µm @ 15 µm: 385 µm |
X-Axis Control | Linear Motor and linear scale with DSP-based controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller |
X-Y Axis Resolution | 0.5 µm |
Z-Axis Resolution | 1 µm |
Max PCB Size | TR7007 SII Ultra: 510 x 460 mm TR7007 SII Ultra DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 50 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement | Height Area Volume Offset |
WxDxH | TR7007 SII Ultra: 1100 x 1480 x 1600 TR7007 SII Ultra DL: 1100 x 1705 x 1600 mm Note: not including signal tower, signal tower height 512 mm |
Weight | TR7007 SII Ultra: 740 kg TR7007 SII Ultra DL: 925 kg |
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