德律TRI(在线)SPI锡膏检查机TR7007Q
设备尺寸(W*D*H): L1400×W1000×H1647mm
设备重量: 675kg
电源要求: 单相 AC200~240V 50/60Hz, 3kVA
气源要求: 0.6MPa (87psi)
设备简介:台湾德律科技(TRI,台北士林)TR7007Q在线3D锡膏检查机,走停式取像配四向数字条纹投影实现无阴影测量,可量测锡膏高度/面积/体积/偏移并检出少锡、多锡、桥接、形状不良,内置智能板弯补偿与SPC、闭环反馈,适合01005~细间距的炉前锡膏检测。平台重量字段误填为尺寸串,原厂净重675kg;外形尺寸原按宽×深×高1000×1400×1647mm标注(不含三色灯),折合长×宽×高为1400×1000×1647mm。展开更多
设备参数
设备文档
配件清单
设备参数
| 参数表 | |
|---|---|
项目 | 规格 |
Imaging Method | Stop-and-Go Imaging |
Camera | 4 Mpix or 12 Mpix (factory setting) |
Imaging Resolution | 6 μm, 10 μm , 15 µm (factory setting) |
Lighting | RGB True Color LED |
3D Technology | 4-way Digital Fringe Pattern |
Field of View | 4 Mpix@ 10 µm: 20.3 x 20.3 mm 4 Mpix@ 15 µm: 30.5 x 30.5 mm 12 Mpix@ 6 µm: 24.4 x 18.4 mm* 12 Mpix@ 10 µm: 40.8 x 30.7 mm 12 Mpix@ 15 µm: 61.2 x 46.1 mm * 6 μm is not available for TR7007Q DL |
Imaging Speed | 4 Mpix: 3 FOV/sec 12 Mpix: 2 FOV/sec 12 Mpix CoaXPress: 3 FOV/sec* Note: Inspection speed depends on PCB and inspection conditions * With optional CoaXPress upgrade |
Height Resolution | @ 6 µm: 0.22 µm @ 10/15 µm: 0.4 µm |
Max. Solder Height | @ 6 µm: 210/420 µm @ 10/15 µm: 420/840 µm |
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller |
X-Y Axis Resolution | 0.5 µm |
Z-Axis Resolution | N/A |
Max PCB Size | TR7007Q: 510 x 460 mm* TR7007Q DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane * 6 μm is only available for TR7007Q, the Max. PCB size is 330 x 310 mm |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Defects | Insufficient Paste /Excessive Paste/ Shape Deformity/ Missing Paste /Bridging |
Measurement | Height Area Volume Offset |
WxDxH | TR7007Q: 1000 x 1400 x 1650 mm TR7007Q DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 520 mm |
Weight | TR7007Q: 675 kg TR7007Q DL: 685 kg |
