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德律 TRI (在线)SPI锡膏检查机 TR7007 SII Plus

设备尺寸(W*D*H): 1100 x 1570 x 1550mm

设备重量: 950KG

电源要求:

气源要求:

设备简介:TR7007 SII Plus是产业最快速的锡膏印刷检测机,检测速度高达200 cm2/sec。高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测,分辨率包含15 µm or 10 µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。TRI快速且直觉化的操作介面提供简易编程、容易操作的优点,为您的生产线带来最大的价值。展开更多

设备参数
设备文档
配件清单
参数表
项目
规格
Imaging Method
Dynamic Imaging
Camera
4 Mpix
Imaging Resolution
10 µm or 15 µm (factory setting)
Lighting
RGB LED
3D Technology
2-way Fringe Pattern
Field of View
4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm
Imaging Speed
4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec
Height Resolution
0.4 µm
Max. Solder Height
@ 10 µm: 420 µm @ 15 µm: 385 µm
X-Axis Control
Linear Motor and linear scale with DSP-based controller
Y-Axis Control
Ballscrew + AC-servo controller
Z-Axis Control
Ballscrew + AC-servo controller
X-Y Axis Resolution
0.5 µm
Z-Axis Resolution
1 µm
Max PCB Size
TR7007 SII Plus: 510 x 460 mm TR7007L SII Plus: 660 x 610 mm TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness
0.6-5 mm
Max PCB Weight
3 kg
Top Clearance
25 mm
Bottom Clearance
40 mm
Edge Clearance
3 mm
Conveyor Height
880 – 920 mm * SMEMA Compatible
Defects
Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement
Height Area Volume Offset
WxDxH
TR7007 SII Plus: 1100 x 1570 x 1550 TR7007L SII Plus: 1300 x 1610 x 1560 mm TR7007 SII Plus DL: 1100 x 1770 x 1560 mm Note: not including signal tower, signal tower height 520 mm
Weight
TR7007 SII Plus: 950 kg TR7007L SII Plus: 1250 kg TR7007 SII Plus DL: 1100 kg
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