德律 TRI SMT自动光学检查机 TR7700QE-S
设备尺寸(W*D*H): 1100 x 1730 x 1750 mm
设备重量: 1100 x 1730 x 1750 mm
电源要求: 200-240VAC
气源要求: 72psi-87psi
设备简介:TR7700QE-S建立在具有5.5 µm高分辨率与12 MP成像技术的高精准度平台上，适用于半导体和封装行业。 一站式3D AOI能够检测打线接合、黏晶、SMD、凸块与锡点等缺陷，并且智能 3D AOI解决方案可通过量测功能和灵活的检测演算法提升准确性。 • 半导体与封装技术检测 • 超高精准度走停式3D AOI • 打线接合与黏晶缺陷检测 • 即时通过TRI智能检测库进行检测展开更多
设备参数
设备文档
配件清单
| 参数表 | |
|---|---|
项目 | 规格 |
Imaging Method | Stop-and-Go Imaging |
Top Camera | 12 Mpix |
Angle Camera | N/A |
Imaging Resolution | 5.5 µm |
Lighting | Multi-phase true color LED |
3D Technology | Quad Digital Fringe Projectors |
Max. 3D Range | 12 Mpix@ 5.5 µm: 4 mm |
Imaging Speed | 12 Mpix 3D @ 5.5 µm: 4.1 cm²/sec 12 Mpix 2D @ 5.5 µm: 10.3 cm²/sec Note: Depending on component distribution |
X-Axis Control | Linear Motor with Motion Controller (Ballscrew + AC Servo Motor Optional) |
Y-Axis Control | Dual driven ballscrew + AC-servo with Motion Controller |
Z-Axis Control | Ballscrew + AC Servo with Motion Controller |
X-Y Axis Resolution | 1 µm |
Max PCB Size | 330 x330 mm* *Depending on component distribution, the vailable PCB size could be different |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm |
Bottom Clearance | 40 mm. Optional: 100 mm |
Edge Clearance | 3 mm. Optional: 5 mm |
Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
WxDxH | 1100 x 1730 x 1750 mm Note: not including signal tower, signal tower height 520 mm |
Weight | 920 kg |
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