德律TRI SMT自动光学检测机TR 7700 QE—S
设备尺寸(W*D*H): L1730×W1100×H1750mm
设备重量: 920kg
电源要求: 单相 AC200~240V 50/60Hz
气源要求: 0.5~0.6MPa
设备简介:台湾德律科技(TRI)面向半导体与封装段的高精度3D AOI，基于5.5µm/1200万像素成像平台，走停式取像配四组数字条纹投影，可检打线(wire bond)、黏晶(die bond)、SMD、凸块与焊点缺陷，并具备量测功能与弹性检测算法，适合SiP、功率模组、Mini-LED等微细封装。平台尺寸原按宽×深×高1100×1730×1750mm标注(不含三色灯)，折合长×宽×高为1730×1100×1750mm；重量字段误填为尺寸串，原厂净重920kg。展开更多
设备参数
设备文档
配件清单
设备参数
| 参数表 | |
|---|---|
项目 | 规格 |
Imaging Method | Stop-and-Go Imaging |
Top Camera | 12 Mpix |
Angle Camera | N/A |
Imaging Resolution | 5.5 µm |
Lighting | Multi-phase true color LED |
3D Technology | Quad Digital Fringe Projectors |
Max. 3D Range | 12 Mpix@ 5.5 µm: 4 mm |
Imaging Speed | 12 Mpix 3D @ 5.5 µm: 4.1 cm²/sec 12 Mpix 2D @ 5.5 µm: 10.3 cm²/sec Note: Depending on component distribution |
X-Axis Control | Linear Motor with Motion Controller (Ballscrew + AC Servo Motor Optional) |
Y-Axis Control | Dual driven ballscrew + AC-servo with Motion Controller |
Z-Axis Control | Ballscrew + AC Servo with Motion Controller |
X-Y Axis Resolution | 1 µm |
Max PCB Size | 330 x330 mm* *Depending on component distribution, the vailable PCB size could be different |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm |
Bottom Clearance | 40 mm. Optional: 100 mm |
Edge Clearance | 3 mm. Optional: 5 mm |
Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
WxDxH | 1100 x 1730 x 1750 mm Note: not including signal tower, signal tower height 520 mm |
Weight | 920 kg |