德律TRI SMT自动光学检测机TR 7500 QE

设备尺寸(W*D*H): W1100 x D1730 x H1750 mm

设备重量: 920kg

电源要求: 单相 AC200~240V, 50/60Hz, 3kVA

气源要求: 72~87psi (5~6bar)，选配气压停板套件时使用

设备简介:TR7500QE 是德律（TRI）多角度 2D+3D 在线 AOI，采用四向可调数字条纹光投影与 4 支 6.5MP 低视角相机，配合 12MP 上视相机，3D 高度范围 0~40mm，可检测爬锡高度与体积、少锡、桥连、立碑、极反等缺陷。光学分辨率 10/15µm，检测速度 13.5~30cm²/sec，选配 CoaXPress 可提升至 23~40cm²/sec；最大基板 510×460mm，支持 SMEMA 联机，适用于炉前/炉后高精度全检。展开更多

设备参数

设备文档

配件清单

参数表
项目	规格
Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix
Angle Camera	6.5 Mpix
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase true color LED, Coaxial lighting
3D Technology	Quad Digital Fringe Projectors
Max. 3D Range	0-40 mm
Imaging Speed	12 Mpix@ 10 µm: 13.5 cm²/sec 12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress 12 Mpix@ 15 µm: 30 cm²/sec 12 Mpix@ 15 µm: 50 cm²/sec with optional CoaXPress Note: The inspection time will vary depending on the configuration
X-Axis Control	Ballscrew + AC-servo controller (Linear motor optional)
Y-Axis Control	Dual driven ballscrew + AC-servo controller
Z-Axis Control	Ballscrew + AC-servo controller
X-Y Axis Resolution	1 µm
Max PCB Size	TR7500QE: 510 x 460 mm TR7500L QE: 660 x 610 mm TR7500QE DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible
Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination
WxDxH	TR7500QE: 1100 x 1730 x 1750 mm TR7500L QE: 1250 x 1880 x 1750 mm TR7500QE DL: 1100 x 1830 x 1750 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7500QE: 920 kg TR7500L QE: 1170 kg TR7500QE DL: 950 kg