德律 TRI SMT自动光学检查机 TR7500QE

设备尺寸(W*D*H): 1100 x 1730 x 1750 mm

设备重量: 1100 x 1730 x 1750 mm

电源要求:

气源要求:

设备简介:TR7500QE AOI 藉由结合以四向可调变数位条纹光投影及四个低视角相机为基础的新世代多角度2D和3D技术，提供了优越的3D锡点和元件组装检测功能。最新的检测软体采用快速CAD资料的编程及高度可客制化模板。 • 多角度2D+3D覆盖率 • 四向数位条纹光投影 • 四个低角度相机 • 3D高度检测范围可高达40 mm • 高速CoaXPress取像 • 可选配3D雷射模组展开更多

设备参数

设备文档

配件清单

参数表
项目	规格
Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix
Angle Camera	6.5 Mpix
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase true color LED, Coaxial lighting
3D Technology	Quad Digital Fringe Projectors
Max. 3D Range	0-40 mm
Imaging Speed	12 Mpix@ 10 µm: 13.5 cm²/sec 12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress 12 Mpix@ 15 µm: 30 cm²/sec 12 Mpix@ 15 µm: 50 cm²/sec with optional CoaXPress Note: The inspection time will vary depending on the configuration
X-Axis Control	Ballscrew + AC-servo controller (Linear motor optional)
Y-Axis Control	Dual driven ballscrew + AC-servo controller
Z-Axis Control	Ballscrew + AC-servo controller
X-Y Axis Resolution	1 µm
Max PCB Size	TR7500QE: 510 x 460 mm TR7500L QE: 660 x 610 mm TR7500QE DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible
Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination
WxDxH	TR7500QE: 1100 x 1730 x 1750 mm TR7500L QE: 1250 x 1880 x 1750 mm TR7500QE DL: 1100 x 1830 x 1750 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7500QE: 920 kg TR7500L QE: 1170 kg TR7500QE DL: 950 kg

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服务号

粤ICP备16005436号

粤公网安备 44030602006037号

联系电话：0755-27820151

地址：广东省深圳市宝安区航城大道159号航城创新创业园a1栋510