设备尺寸(W*D*H): 1100 x 1730 x 1750 mm
设备重量: 1100 x 1730 x 1750 mm
电源要求: 200-240VAC
气源要求: 72psi-87psi
设备简介:TR7700QE AOI 藉由结合以四向可调变数位条纹光投影为基础的新世代2D和3D技术,提供了优越的3D锡点和元件组装检测功能。最新的检测软体采用快速CAD资料的编程及高度可客制化模板。 • 优越的2D+3D检测覆盖率 • 四向数位条纹光投影 • 3D高度检测范围可高达40 mm • 高速CoaXPress取像 • 可选配3D雷射模组展开更多
参数表 | |
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项目 | 规格 |
Imaging Method | Stop-and-Go Imaging |
Top Camera | 12 Mpix |
Angle Camera | N/A |
Imaging Resolution | 10 µm, 15 µm (factory setting) |
Lighting | Multi-phase true color LED, Coaxial lighting |
3D Technology | Quad Digital Fringe Projectors |
Max. 3D Range | 0-40 mm* * Requires Z axis control. The default 3D height is 0 – 20mm |
Imaging Speed | 12 Mpix@ 10 µm: 13.5 cm²/sec 12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress 12 Mpix@ 15 µm: 30 cm²/sec 12 Mpix@ 15 µm: 50 cm²/sec with optional CoaXPress Note: Depending on component distribution |
X-Axis Control | Ballscrew + AC-servo controller (Linear motor optional) |
Y-Axis Control | Dual driven ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller (optional) |
X-Y Axis Resolution | 1um |
Max PCB Size | TR7700QE: 510 x 460 mm TR7700L QE: 660 x 610 mm TR7700QE DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 50 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor | 880 - 920 mm |
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
WxDxH | TR7700QE: 1100 x 1730 x 1750 mm TR7700L QE: 1250 x 1880 x 1750 mm TR7700QE DL: 1100 x 1830 x 1750 mm Note: not including signal tower, signal tower height 520 mm |
Weight | TR7700QE: 920 kg TR7700L QE: 1170 kg TR7700QE DL: 950 kg |
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