德律TRI SMT自动光学检测机TR 7500 SIII
设备尺寸(W*D*H): W1100 x D1670 x H1550 mm
设备重量: 1030kg
电源要求: 单相 AC200~240V, 50/60Hz, 3kVA
气源要求: 72~87psi (5~6bar)
设备简介:TR7500 SIII 是德律（TRI）第三代在线 AOI，采 4MP 上视相机加 4 支 1.3/6.5MP 低视角相机的五镜头架构与多相位 RGB+W 光源，2D 检测速度 60/120cm²/sec，分辨率 10/15µm，最大基板 510×460mm，可选配双 3D 雷射升级为 3D 检测。智能编程 GUI 支持离线编辑，SMEMA 联机，适用于炉前/炉后焊点与元件外观检查。展开更多
设备参数
设备文档
配件清单
设备参数
| 参数表 | |
|---|---|
项目 | 规格 |
Imaging Method | Dynamic Imaging |
Top Camera | 4 Mpix |
Angle Camera | 1.3 Mpix or 6.5 Mpix (factory setting) |
Imaging Resolution | 10 µm, 15 µm (factory setting) |
Lighting | Multi-phase RGB+W LED |
3D Technology | Single/Dual 3D laser sensors |
Max. 3D Range | 20 mm (with 3D Laser Sensor upgrade optional) |
Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec |
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1um |
Max PCB Size | TR7500 SIII: 510 x 460 mm TR7500L SIII: 660 x 610 mm TR7500 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm [48 mm optional] |
Bottom Clearance | 40mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
WxDxH | TR7500 SIII: 1100 x 1670 x 1550 mm TR7500L SIII: 1300 x 1630 x 1655 mm TR7500 SIII DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
Weight | TR7500 SIII: 1030 kg TR7500L SIII: 1255 kg TR7500 SIII DL: 1150 kg |