德律 TRI SMT自动光学检查机 TR7500 SIII

设备尺寸(W*D*H): 1100 x 1670 x 1550 mm

设备重量: 1030KG

电源要求:

气源要求:

设备简介:TRI顶尖的在线型AOI解决方案，提供超高速五支相机镜头的组装电路板检测，具有可靠的缺陷检测功能，即使是最复杂的焊点以及组装缺陷皆能检出。TR7500 SIII搭载智能化软件和高性能硬体的强大组合，提供可靠且易于使用的AOI解决方案，更致力于集中在高精度的检测结果并将誤判降到最低，以帮助优化您的生产产量。 • 高精度五支镜头的多相AOI • 智能编程的GUI与离线编辑功能 • 智能化自动输送带系统可减少进出板时间 • 检测可靠，高精度，低误判展开更多

设备参数

设备文档

配件清单

参数表
项目	规格
Imaging Method	Dynamic Imaging
Top Camera	4 Mpix
Angle Camera	1.3 Mpix or 6.5 Mpix (factory setting)
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	Single/Dual 3D laser sensors
Max. 3D Range	20 mm (with 3D Laser Sensor upgrade optional)
Imaging Speed	4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec
X-Axis Control	Ballscrew + AC-servo controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	N/A
X-Y Axis Resolution	1um
Max PCB Size	TR7500 SIII: 510 x 460 mm TR7500L SIII: 660 x 610 mm TR7500 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	25 mm [48 mm optional]
Bottom Clearance	40mm
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible
Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination
WxDxH	TR7500 SIII: 1100 x 1670 x 1550 mm TR7500L SIII: 1300 x 1630 x 1655 mm TR7500 SIII DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7500 SIII: 1030 kg TR7500L SIII: 1255 kg TR7500 SIII DL: 1150 kg