设备尺寸(W*D*H): 1470 x 1971 x 1974 mm
设备重量: 1470 x 1971 x 1974 mm
电源要求: 200 - 240 VAC single phase, 50/60 Hz, 4 kVA
气源要求:
设备简介:新一代的高速在线型TR7600F3D SII自动X射线检测解决方案,检测速度比上一代产品可快达两倍至三倍,可检测最大至900mm x 460mm的大型电路板;在不影响生产线生产时间的情况下,可同时降低漏测和误判率。 • 5 µm 高精准全面缺陷检测 • 新一代机械设计提供更快的速度,最高可达10 FOV/s • 方便整合于智能工厂的MES串接展开更多
参数表 | |
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项目 | 规格 |
Camera | Flat Panel Detector |
X-ray Source | 130 kV Max (User Adjustable) |
Imaging Resolution | 5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm (Choose 3 Resolutions) |
Inspection Method | 2D, 2.5D, 3D Slicing, Planar CT (Optional) |
X-Axis Control | High-Precision Ballscrew + AC-Servo Controller |
Y-Axis Control | High-Precision Ballscrew + AC-Servo Controller |
Z-Axis Control | High-Precision Ballscrew + AC-Servo Controller |
X-Y Axis Resolution | N/A |
Max PCB Size | 900 x 460 mm* * The Max. PCB Size will vary depending on the angle of incidence |
PCB Thickness | 0.6 - 7 mm |
Max PCB Weight | 12kg |
Top Clearance | @ 20/25/30 μm: 50 mm @ 15 μm: 45 mm @ 10 μm: 25 mm @ 5 μm: 5 mm |
Bottom Clearance | @ 30 μm: 55 mm @ 5/10/15/20/25 μm: 70 mm |
Edge Clearance | 3 mm or 5 mm |
Conveyor Height | 880 - 920 mm * SMEMA Compatible |
Component | Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
Solder | Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
WxDxH | 1470 x 1971 x 1974 mm Note: not including signal tower, height: 510 mm |
Weight | 3850 kg |
Power Requirement | 200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
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