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德律TRI AXI检测设备TR 7600 TL SIII

设备尺寸(W*D*H): L2014×W2000×H1940mm

设备重量: 4750kg

电源要求: 三相 AC200~240V 50/60Hz, 7kVA(可选 346~416V 三相变压器)

气源要求: 0.5~0.6MPa(5~6bar)

设备简介:德律科技(TRI,台湾)TR7600TL SIII 是 TR7600 SIII 系列中的超大板在线式 3D CT AXI,专为 1200×660mm(双段传送)大尺寸电路板设计。采用 3~5 组超高速线扫 CCD 相机与 130kV 可调微焦 X 射线源,分辨率 10/15/20/25µm 可选,支持 2D、2.5D、3D 切片及选配平面 CT,可检出缺件、偏移、立碑、极性反、连锡、空焊、气泡等缺陷。X-Y-Z 三轴滚珠丝杆配 AC 伺服,重复精度 1µm,SMEMA 接口可直连产线。平台原「设备重量」误填为尺寸字符串,实际整机净重 4750kg。展开更多

设备参数
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设备参数

参数表
项目
规格
Camera
Ultra-High Speed Line-Scan CCD Cameras (3 or 5 Units)
X-ray Source
Microfocus tube 130 kV max (user adjustable)
Imaging Resolution
10 μm, 15 μm, 20 μm, 25 μm (user Selectable)
Inspection Method
2D, 2.5D, 3D Slicing, Planar CT (optional)
X-Axis Control
High-precision ballscrew + AC-servo controller
Y-Axis Control
High-precision ballscrew + AC-servo controller
Z-Axis Control
High-precision ballscrew + AC-servo controller
X-Y Axis Resolution
1um
Max PCB Size
Standard: 610 x 660 mm 2 Stages: 1200 x 660 mm
PCB Thickness
0.6-7 mm
Max PCB Weight
12 kg
Top Clearance
@ 25 μm: 50 mm @ 20 μm: 50 mm @ 15 μm: 30 mm @ 10 μm*: 15 mm * For confirming the specific technical requirements, please contact TRI’s sales representative
Bottom Clearance
@ 25 μm: 55 mm @ 20 μm: 70 mm @ 15 μm: 70 mm @ 10 μm: 70 mm
Edge Clearance
3 mm or 5 mm
Conveyor Height
880 - 920 mm * SMEMA Compatible
Component
Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating
Solder
Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead
WxDxH
2014 x 2000 x 1940 mm Note: not including signal tower, height: 510 mm
Weight
4750 kg
Power Requirement
200 – 240 VAC, Three Phase, 50 / 60 Hz, 7 kVA. Optional: 346 – 416 VAC Three Phase Transformer

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