设备尺寸(W*D*H): 1470 x 2110 x 1975 mm
设备重量: 1470 x 2110 x 1975 mm
电源要求: 200 - 240 VAC single phase, 50/60 Hz, 4 kVA
气源要求:
设备简介:TR7600 SIII CT AXI系列为TRI新一代具指标性的在线型PCBA检测解决方案。TR7600SIII包含可配合生产线速度达到100%检测覆盖率的设计,结合了业界最快速的高解析取像速度,并在业界最先进的自动X光检测中大大提升了影像品质。 • 超高速3D CT X射线检测 • 优越的影像品质 • 真实3D锡点检视 • 高解析度可检测小至01005in晶片展开更多
参数表 | |
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项目 | 规格 |
Camera | Ultra-High Speed Line-Scan CCD Cameras (3 or 5 Units) |
X-ray Source | Microfocus tube 130 kV max (user adjustable) |
Imaging Resolution | 7 μm, 10 μm, 15 μm, 20 μm (user selectable) |
Inspection Method | 2D, 2.5D, 3D Slicing, Planar CT (Optional) |
X-Axis Control | High-precision ballscrew + AC-servo controller |
Y-Axis Control | High-precision ballscrew + AC-servo controller |
Z-Axis Control | High-precision ballscrew + AC-servo controller |
X-Y Axis Resolution | 1um |
Max PCB Size | Standard: 510 x 460 mm 2 Stages: 900 x 460 mm |
PCB Thickness | 0.6-7 mm |
Max PCB Weight | 12kg |
Top Clearance | @ 20 μm: 50 mm @ 15 μm: 30 mm @ 10 μm: 15 mm @ 7 μm: 7 mm |
Bottom Clearance | 70 mm |
Edge Clearance | 3 mm or 5 mm |
Conveyor Height | 880 - 920 mm |
Component | Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
Solder | Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
WxDxH | 1470 x 2110 x 1975 mm Note: not including signal tower, height: 510 mm |
Weight | 3850 kg |
Power Requirement | 200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
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