德律 TRI AXI检查设备 TR7600XLL SII
设备尺寸(W*D*H): 1750 x 2140 x 1945 mm
设备重量: 1750 x 2140 x 1945 mm
电源要求: 200 - 240 VAC three phase, 50/60 Hz, 7 kVA (346-416 VAC optional three phase transformer)
气源要求:
设备简介:TR7600XLL SII是一款针对大型伺服器、网络和大型PCB所设计的高性能、高速3D AXI。 TRI AXI具独特无阴影检测技术，可检测多层电路板上2-3层的PoP BGA, μBGAs、方型无引脚封装(QFN)、高密度连接器(Press-fit)等元件，具有全智能编程和同一程式分辨率的优点，有助于大大地提高生产线产值 • 最大可测电路板尺寸可达 1000 x 660 mm • 自动编程大幅节省工程师的工作量 • 多解析度编程和高品质影像的进阶处理 • 使用数位断层合成技术自动提取2D+3D切片影像 • X射线tube最大值可达130 kV/300 μA 展开更多
设备参数
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配件清单
| 参数表 | |
|---|---|
项目 | 规格 |
Camera | High-performance, ultra-sensitive bidirectional line-scan cameras |
X-ray Source | Microfocus tube 130 kV max (user adjustable) |
Imaging Resolution | 7 μm, 10 μm, 15 μm, 20 μm (3 settings factory configured) |
Inspection Method | 2.5D, 3D Slicing, Planar CT (optional) |
X-Axis Control | High-precision ballscrew + AC-servo controller |
Y-Axis Control | High-precision ballscrew + AC-servo controller |
Z-Axis Control | High-precision ballscrew + AC-servo controller |
X-Y Axis Resolution | 1um |
Max PCB Size | 1000 x 660 mm |
PCB Thickness | 0.6-7 mm |
Max PCB Weight | 12 kg [15 kg optional] |
Top Clearance | @ 20 μm: 50 mm @ 15 μm: 30 mm @ 10 μm: 15 mm @ 7 μm: 7 mm |
Bottom Clearance | 70mm |
Edge Clearance | 3 mm or 5 mm |
Conveyor Height | 880 - 920 mm * SMEMA Compatible |
Component | Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
Solder | Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
WxDxH | 1750 x 2140 x 1945 mm Note: not including signal tower, height: 510 mm |
Weight | 4500 kg |
Power Requirement | 200 - 240 VAC three phase, 50/60 Hz, 7 kVA (346-416 VAC optional three phase transformer) |
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