设备尺寸(W*D*H): 1500 x 2060 x 1650 mm
设备重量: 1500 x 2060 x 1650 mm
电源要求: 200 – 240 VAC single phase, 50/60 Hz, 4 kVA
气源要求:
设备简介:TR7600F2D是一台高性能的在线型2.5D AXI,专门用于检测需要高影像品质的单面组装电路板和软板组件。非常适合应用于电子通讯产品的检测,TR7600F2D能可靠地检测出微小的气泡、01005焊点缺陷以及许多QFN和BGA的问题。TR7600F2D结合了全自动化编程和多分辨率,有助于所有生产线大大提高产量。 • 超高分辨率、最大可测电路板可达900 x 460 mm • 自动编程大幅节省工程师的工作量 • 多分辨率编程和高品质影像的进阶处理 • 无阴影检测的2D和离轴影像 • X射线tube最大值可达130 kv/300 µA展开更多
参数表 | |
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项目 | 规格 |
Camera | High resolution flat panel camera |
X-ray Source | Microfocus tube 130 kV max (user adjustable) |
Imaging Resolution | 5 μm, 10 μm, 15 μm (factory setting) |
Inspection Method | 2D, 2.5D, Planar CT (optional) |
X-Axis Control | High-precision ballscrew + AC-servo controller |
Y-Axis Control | High-precision ballscrew + AC-servo controller |
Z-Axis Control | High-precision ballscrew + AC-servo controller |
X-Y Axis Resolution | 1um |
Max PCB Size | 900 x 460 mm |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg [8 kg optional] |
Top Clearance | @ 15 μm: 30 mm @ 10 μm: 20 mm @ 5 μm: 10 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height | 880 - 920 mm * SMEMA Compatible |
Component | Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
Solder | Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
WxDxH | 1500 x 2060 x 1650 mm Note: not including signal tower, height: 515 mm |
Weight | 3250 kg |
Power Requirement | 200 – 240 VAC single phase, 50/60 Hz, 4 kVA |
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