迈康尼 MYCRONIC 贴片机 MY300HX
设备尺寸(W*D*H): 2080x1340x1406mm
设备重量: 1600KG
电源要求: AC220V 50HZ
气源要求: 0.5±0.05Mpa
设备简介:SYSTEM FEATURES MY300HX On-the-fly mount order optimization Vision autoteach with snap-to-grid Automatic illumination settings Intelligent feeder concept – Agilis Automatic feeder and component recognition On-the-fly feeder loading Dynamic feeder positions Automatic board stretch compensation Automatic conveyor width adjustment Intelligent surface impact control Tool collision avoidance Multi-user, multi-tasking system software Open software interfaces for factory integration展开更多
设备参数
设备文档
配件清单
| PLACEMENT SPEED AND ACCURACY | |
|---|---|
Rated speed | 45 000 CPH |
IPC 9850 chip net throughput | 33 000 CPH |
IPC 9850 chip repeatability (X, Y, Theta) | 30 μm, 1.8°
45 μm, 1.8° |
IPC 9850 chip tact time | 0.097 s |
IPC 9850 chip accuracy @ Cpk = 1.33 (X, Y, Theta) | 50 μm, 2.6°
75 μm, 2.6° |
| BOARD HANDLING | |
|---|---|
Maximum board size | 460 x 510 mm |
Minimum board size | 70 x 50 mm |
Board thickness range | 0.4 – 6.0 mm |
Board edge clearance top | 3.2 mm |
Board edge clearance bottom | 3.2 mm |
Top side clearance (max) | 5.6 mm |
Bottom side clearance (max) | 32 mm |
Maximum board weight | 4 kg (8.8 lbs) |
Board transfer height | Conforms to SMEMA standard for board transfer height.
Height adjustable from 880 to 975 mm |
Operation mode | Inline, manual, inline odd-board, left-to-right / right-to-left. |
| VISION CAPABILITY | |
|---|---|
Leaded components | 0.20 mm (8 mil) |
Bumped components | 0.25 mm (10 mil) |
Component range | Chip (from 01005), SO28, SOT223, SOJ20, PLCC32, MELF,
SOD, TSOP |
Component specification | Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005)
Max: 18.6 x 18.6 x 5.60 mm (0.73” x 0.73” x 0.22”) (PLCC44) |
Component range | Resistor, capacitor, unipolar capacitor, diode (forward voltage,
reverse current), Zener diode (voltage drop), transistor (current gain) |
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