MYCRONIC迈尼贴片机MY 300 DX
设备尺寸(W*D*H): 3304x1438x1406mm
设备重量: 2200KG
电源要求: AC220V 50HZ
气源要求: 0.5±0.05Mpa
设备简介:SYSTEM FEATURES MY300DX On-the-fly mount order optimization Vision autoteach with snap-to-grid Automatic illumination settings Intelligent feeder concept – Agilis Automatic feeder and component recognition On-the-fly feeder loading Dynamic feeder positions Automatic board stretch compensation Automatic conveyor width adjustment Intelligent surface impact control Tool collision avoidance Multi-user, multi-tasking system software Open software interfaces for factory integration展开更多
设备参数
设备文档
配件清单
设备参数
| PLACEMENT SPEED AND ACCURACY | |
|---|---|
Rated speed | 40 000 CPH |
IPC 9850 chip net throughput | 32 000 CPH |
IPC 9850 chip tact time | 0.103 s |
IPC 9850 chip (X,Y,Theta) | 30 μm, 1.8°
45 μm, 1.8° |
IPC 9850 chip accuracy @ Cpk = 1.33 (X, Y, Theta) | 50 μm, 2.6°
75 μm, 2.6° |
IPC 9850 fine pitch repeatability (X, Y, Theta) | 21 μm, 0.05° |
IPC 9850 fine pitch accuracy @ Cpk = 1.33 (X, Y, Theta) | 35 μm, 0.09° |
| BOARD HANDLING | |
|---|---|
Maximum board size | 460 x 510 mm |
Minimum board size | 70 x 50 mm |
Board thickness range | 0.4-6.0 mm |
Board edge clearance top | 3.2 mm |
Board edge clearance bottom | 3.2 mm |
Top side clearance (max) | 15 mm |
Bottom side clearance (max) | 32 mm |
Maximum board weight | 4 kg |
| VISION CAPABILITY | |
|---|---|
Leaded components | 80 mm |
Bumped components | 80 mm |
Component range | Chip (from 03015), SOIC, PLCC, TSOP, QFP, BGA, flip chip, oddshape, surface-mount connectors, through-hole components, CSP, CCGA, DPAK, Alcap, Tantalum |
Component specification | Min: 0.3 x 0.15 (0.012” x 0.006”) (03015)
Max: 140 x 73 x 15 mm (5.51” x 2.87” x 0.59”)
Max: component weight: 140 g |
Component range | Resistor, capacitor, unipolar capacitor, diode (forward voltage,
reverse current), Zener diode (voltage drop), transistor (current
gain). Smallest chip size 1.0 x 0.5 mm (0.04” x 0.02”) |