MYCRONIC 迈康尼贴片机 MY300DX

设备尺寸(W*D*H): 3304x1438x1406mm

设备重量: 2200KG

电源要求: AC220V 50HZ

气源要求: 0.5±0.05Mpa

设备简介:SYSTEM FEATURES MY300DX On-the-fly mount order optimization Vision autoteach with snap-to-grid Automatic illumination settings Intelligent feeder concept – Agilis Automatic feeder and component recognition On-the-fly feeder loading Dynamic feeder positions Automatic board stretch compensation Automatic conveyor width adjustment Intelligent surface impact control Tool collision avoidance Multi-user, multi-tasking system software Open software interfaces for factory integration展开更多

设备参数

设备文档

配件清单

PLACEMENT SPEED AND ACCURACY
Rated speed	40 000 CPH
IPC 9850 chip net throughput	32 000 CPH
IPC 9850 chip tact time	0.103 s
IPC 9850 chip (X,Y,Theta)	30 μm, 1.8° 45 μm, 1.8°
IPC 9850 chip accuracy @ Cpk = 1.33 (X, Y, Theta)	50 μm, 2.6° 75 μm, 2.6°
IPC 9850 fine pitch repeatability (X, Y, Theta)	21 μm, 0.05°
IPC 9850 fine pitch accuracy @ Cpk = 1.33 (X, Y, Theta)	35 μm, 0.09°

BOARD HANDLING
Maximum board size	460 x 510 mm
Minimum board size	70 x 50 mm
Board thickness range	0.4-6.0 mm
Board edge clearance top	3.2 mm
Board edge clearance bottom	3.2 mm
Top side clearance (max)	15 mm
Bottom side clearance (max)	32 mm
Maximum board weight	4 kg

VISION CAPABILITY
Leaded components	80 mm
Bumped components	80 mm
Component range	Chip (from 03015), SOIC, PLCC, TSOP, QFP, BGA, flip chip, oddshape, surface-mount connectors, through-hole components, CSP, CCGA, DPAK, Alcap, Tantalum
Component specification	Min: 0.3 x 0.15 (0.012” x 0.006”) (03015) Max: 140 x 73 x 15 mm (5.51” x 2.87” x 0.59”) Max: component weight: 140 g
Component range	Resistor, capacitor, unipolar capacitor, diode (forward voltage, reverse current), Zener diode (voltage drop), transistor (current gain). Smallest chip size 1.0 x 0.5 mm (0.04” x 0.02”)

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粤ICP备16005436号

粤公网安备 44030602006037号

联系电话：0755-27820151

地址：广东省深圳市宝安区航城大道159号航城创新创业园a1栋510

MYCRONIC 迈康尼 贴片机 MY300DX

MYCRONIC 迈康尼贴片机 MY300DX