Parameter
Item	Spec
Max PCB size	50 mm x 50 mm
Min PCB size	460 mm x 360 mm
PCB EXCHANGE TIME	4.0 s (When no components are placed on the back of the PCB)
基板传送时间(秒)	3.5sec以下(基板Size：～330×250mm) 4.0sec以下(基板Size ：～460×360mm)
基板Size L×W×T（㎜）	50×50×0.3～460×250×4 50×50×0.3～460×360×4
Tape搭载品种数	70 Slot/70品种(8/12/16 ㎜)*8mm：最大140品种(Double T/F规格)

Placement accuracy
HIGH-SPEED (12 Nozzles)	HIGH-SPEED (LS8 Nozzles)	MULTI-FUNCTION(3 Nozzles)
0.144 s/chip (for type A-2 head)	0.19 s/chip (for type A-0 head)	0.8 s/QFP (for type B head)
±40 µm/chip (Cpk≥1)	±50 µm/chip ±35 µm/chip (Cpk≥1)	±50 µm/chip ±35 µm/chip (Cpk≥1)
0402 (01005") chip to L12xW12xT6.5	0402 (01005") chip to L100xW50xT15	0603 (0201") chip to L100xW90xT25
25000CPH(理论)	19000CPH(理论)	7200CPH(理论)
17000CPH(实际)	14000CPH(实际)	5000CPH(实际)