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K5042A

英文名: 连接器

中文名: 连接器

韩文名:

日文名:

材质: 暂无信息

规格: PC06-02

单位: 1

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ConnX_ELITE_Opto_150421PDFA.pdf
ConnXPS ELITETM Opto is the latest High Speed Wire Bonder in the industry leading Power Series. Updated motion control systems and the Quick-LED Suite processes deliver maximum productivity and simplified process optimization. ConnX ELITE Opto sets the new standard in interconnection for LED packages.The Power Series of Semiconductor Assembly Equipment from K&S has established itself as the leading equipment. These products reinforce two key principles, the Powerful performance built into these products, and the Power of K&S as the Technology Leader of its market space for more than six decades.The Power Series has set new standards for performance, productivity, upgradeability, and ease of use. The technical success and customer acceptance of the Power Series of products since their introduction are evidence of the K&S continued commitment for providing products with the Power to handle not only today’s most challenging packaging applicatio1, but also tomorrow’s.From K&S —the most Powerful name in Package AssemblyFeatures▪ Bondable Area of 56 mm x 80 mm▪ 3.0 µm accuracy @ 3 sigma▪ New High Speed X-Y-Z motion control and vision systems▪ New proprietary Quick-LED Suite provides robust process performance at maximum UPH▪ Interactive Programmable Look Ahead Vision for ease of set-up for maximum throughput▪ Complete Illumination System with automatic adjustment for PRS robustness▪ Single 2X magnification optics▪ Auto SHTL and NSOL Recovery for improved MTBA performance▪ Auto-BITS self-teach and optimization▪ Optio1◦ Bonding Ag-Alloy, PdCu and Cu wire◦ 2X/4x Dual Magnification Optics◦ Reel-To-Reel Material HandlingAutomatic Wire Bonder
小册子 英文
ConnX_ELITE_Opto_150421PDFA.pdf
For sales, service and manufacturing locatio1, visit www.k1.com© 2018 Kulicke & Soffa Industries Inc. Specificatio1 may change without notice.Trademarks used herein are the property of Kulicke & Soffa Industries, Inc. or their respective owne1.BB-034-032018Power SeriesWire Bonde1 include:User interface that retai1 the familiar K&S look and feel; minimal training needed to become familiar with new performance enhancing and productivity increasing featuresCE CertificationSemi E10 Compliance for Run Time Statistics and MTBA / MTBF calculatio1Upgradeability withPower Pack Upgrade KitsFull KNet PLUS compatibility and readinessWIRE BONDING CAPABILITYBonding Area X Axis: 56 mm Y Axis: 80 mmTotal Bond Placement Accuracy 3.0 μm @ 3 sigmaPattern Recognition/Optics/Vision Progressive Scan Vision Engine CCD Video Camera - 2X Magnification Optics - 2X/4X Dual Magnification Optics (Optional)LOOPING CAPABILITY (with 25.4 μm wire diameter)Maximum Wire Length 5 mmMinimum Loop Height 65 μm Quick Loop-LED supports for flexible loop shapes for improved reliabilityWire Sway Wire length < 2.54 mm: 25 μm @ 3 sigma Wire length > 2.54 mm: ± 1 % wire length @ 3 sigmaCONVERSION TIMESSame Leadframe Type: < 4 min (Heat block i1ert & clamp changes, program load from disk)Different Leadframe Type: < 8 min (Leadframe width & length changes, magazine size change, heat block i1ert & clamp change, program load from disk)KNET PLUS ASSEMBLY EQUIPMENT NETWORK KNet PLUS improves efficiency and productivity, by monitoring equipment status in real-time. It collects data and controls process programs locally or from anywhere on a customer’s network. Contact your K&S Sales Representative to learn more.MATERIAL HANDLING CAPABILITYPackage/Leadframe Dime1io1 Length: 63 to 300 mm Width: 15 to 92 mm (L/F smaller than 25 mm will require optional Narrow Leadframe Kit) Thickness: 0.10 to 0.9 mm (L/F thicker than 0.9mm will require optional Flat Boat Kit) Die Pad Dow1et: Up to 2.3 mmMagazine Dime1io1 Width: 20 to 98 mm Length: 70 to 305 mm (Magazine shorter than 127 mm will require optional Short Magazine Handler kit) Height: 50 to 178 mm Slot Pitch: 1.27 to 25 mm Max. Weight: 5.22 kgMAN-MACHINE INTERFACEMonitor 17” color LED LCD displayDurable Control Panel Function keys and dedicated butto1, and user-friendly mouseIndustry-Recognized User Interface Simple pull-down menus. Color-overlays of wire groups for easy programming and teachFACILITY REQUIREMENTSMinimum Air Pressure 3.52 kg/sq cm (50 psi)Nominal Air Co1umption (flow rate) 185 lite1/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)Input Voltage Standard 200 - 240 VAC; -15 % to + 10% Single Phase 50/60 Hz (± 3 Hz) Optional 100 - 115 VAC; -15 % to + 10% Single Phase 50/60 Hz (± 3 Hz)Power Co1umption 1.5 KVA (nominal), 2.6 KVA (max.)Footprint Base machine with MHS 889 mm wide x 990 mm deep (35” x 39”)Weight (estimated) Machine 556 kg (1226 lbs) Machine & Crate 670 kg (1477 lbs)Automatic Wire Bonder
小册子 英文